BGA Reballing Stencil 90×90mm GTX1070 GTX1060 GP104 GP106

BGA Reballing Stencil 90×90mm GTX1070 GTX1060 GP104 GP106

90x90 / China Mainland
Sale price  $12.00 USD Regular price  $14.29 USD
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BGA Reballing Stencil 90×90mm GTX1070 GTX1060 GP104 GP106

BGA Reballing Stencil 90×90mm GTX1070 GTX1060 GP104 GP106

Sale price  $12.00 USD Regular price  $14.29 USD
Color
Ships FromChina Mainland

Direct Heating BGA Reballing Stencil – 90×90mm for GTX 1070 & GTX 1060 GPUs

Achieve precise, professional BGA reballing results with this 90×90mm direct heating stencil. Designed for technicians and electronics repair enthusiasts, this 0.45mm stencil is compatible with popular NVIDIA GPU chips including the GTX1070 (GP104-400-A1), N17E-G2-A1, GTX1060 (GP106-400-A1), and more. Whether you're reworking a laptop GPU or desktop graphics card, this stencil ensures accurate solder ball placement every time.

Key Features

  • Compatible Chips: GTX1070 GP104-400-A1 | N17E-G2-A1 | GTX1060 GP106-400-A1
  • Stencil Size: 90mm × 90mm – standard size for direct heating reballing jigs
  • Thickness: 0.45mm for optimal solder paste or solder ball deposition
  • Direct Heating Ready: Engineered for use directly over the BGA chip with a heat gun or rework station
  • Precision Laser-Cut: Clean, burr-free apertures for consistent, reliable solder ball alignment
  • Condition: Brand new
  • Package Type: BGA

Who Is This For?

This stencil is ideal for professional PCB repair technicians, electronics hobbyists, and GPU rework specialists who need reliable, repeatable results when reballing NVIDIA graphics chips. It pairs perfectly with standard reballing jigs and rework stations.

What's in the Box?

  • 1 × Direct Heating BGA Reballing Stencil (90×90mm, 0.45mm thickness)

Made in Mainland China.

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Frequently Asked Questions

Q: What GPU chips is this BGA reballing stencil compatible with?

A: This 90×90mm direct heating stencil is compatible with NVIDIA GTX1070 (GP104-400-A1), N17E-G2-A1, and GTX1060 (GP106-400-A1) GPU chips. Always verify the chip model and ball pitch before use to ensure a proper fit.

Q: What does "direct heating" mean for a BGA stencil?

A: A direct heating stencil is placed directly over the BGA chip on the PCB and heated with a hot air rework station or heat gun. This allows solder balls to be reflowed or applied without the need for a separate reballing jig, making the process faster and more straightforward for experienced technicians.

Q: What is the thickness of this stencil and why does it matter?

A: This stencil is 0.45mm thick, which determines the volume of solder paste deposited through each aperture. The correct thickness ensures the right solder ball size for reliable electrical connections on your GPU after reballing.

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