LPDDR4 LPDDR4X BGA200 Direct Heating Reballing Stencil
LPDDR4 LPDDR4X BGA200 Direct Heating Reballing Stencil
LPDDR4 / LPDDR4X BGA200 Direct Heating Reballing Stencil
Achieve precise, professional-grade BGA reballing results with this high-quality Direct Heating Stencil designed for LPDDR4 and LPDDR4X memory chips. Compatible with a wide range of RAM chip models including D9WMH, D9ZCL, D9WLV, D9ZCK, D9WLQ, D9TFW, D9TFT, D9TXQ, K4UCE3Q4AB-MGCL, and K4F6E304HB-MGCH, this stencil is an essential tool for electronics repair technicians and hobbyists working on computer motherboard memory chip rework.
Key Features
- Wide Compatibility: Supports LPDDR4 and LPDDR4X BGA200 package chips used in laptops, tablets, and mobile devices.
- Direct Heating Design: Engineered for direct-heat reballing — no need for flux-coated balls or transfer boards, saving time and improving accuracy.
- Precise BGA Grid: Laser-cut openings ensure consistent solder ball placement across all 200 BGA pads for reliable electrical connections.
- Durable Construction: Made from high-grade stainless steel for repeated use without warping or clogging.
- New Condition: Supplied brand new in SMD-compatible packaging.
- Customizable: Available as a customized solution tailored to your specific chip rework needs.
Compatible Chip Models
- D9WMH
- D9ZCL
- D9WLV
- D9ZCK
- D9WLQ
- D9TFW
- D9TFT
- D9TXQ
- K4UCE3Q4AB-MGCL
- K4F6E304HB-MGCH
Specifications
- Type: Direct Heating BGA Reballing Stencil
- Package: BGA200 / SMD
- Application: Computer / Laptop Motherboard Memory Chip Rework
- Condition: New
- Quantity: 1 Stencil
- Customized: Yes
- Country of Origin: Made in China
Who Is This For?
This stencil is ideal for professional electronics repair technicians, board-level repair shops, and advanced DIY enthusiasts who perform BGA rework on LPDDR4 and LPDDR4X memory chips. Whether you're replacing faulty RAM on a laptop motherboard or reworking a mobile device's memory module, this stencil ensures consistent, repeatable results every time.
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Frequently Asked Questions
Q: What memory chip types is this BGA200 direct heating stencil compatible with?
A: This stencil is compatible with LPDDR4 and LPDDR4X BGA200 package memory chips, including models D9WMH, D9ZCL, D9WLV, D9ZCK, D9WLQ, D9TFW, D9TFT, D9TXQ, K4UCE3Q4AB-MGCL, and K4F6E304HB-MGCH — commonly found in laptops, tablets, and mobile devices.
Q: What is a direct heating reballing stencil and how does it differ from a regular stencil?
A: A direct heating stencil is placed directly on the chip and heated with a hot air station or soldering iron, allowing solder balls to be placed and reflowed in one step — without a separate transfer board. This speeds up the reballing process and improves placement accuracy compared to traditional indirect methods.
Q: Is this stencil reusable?
A: Yes. The stencil is made from durable stainless steel and is designed for multiple uses. After each reballing session, clean it carefully with flux remover or isopropyl alcohol to maintain the integrity of the laser-cut openings for future use.
Q: Can I get a custom stencil for a different BGA chip not listed here?
A: Yes, customized stencils are available. If your chip model is not listed, please contact us with your chip specifications and we can arrange a custom order to fit your exact BGA pad layout.