GTX 1660 TU116 Direct Heating BGA Reballing Stencil 9×9
GTX 1660 TU116 Direct Heating BGA Reballing Stencil 9×9
GTX 1660 TU116 Direct Heating BGA Reballing Stencil – 9×9
Precision-engineered for GPU chip reballing, this direct heating BGA stencil is compatible with a wide range of NVIDIA GTX 1660 TU116-series chips. Whether you're a professional board repair technician or a seasoned DIY electronics hobbyist, this stencil delivers the accuracy and reliability needed for clean, consistent solder ball placement every time.
Compatible GPU Chips
- TU116-300-A1
- TU116-400-A1
- TU116-100-A1
- TU116-150-KA-A1
- TU116-250-KA-A1
- N18P-G61
- TU116 / TU116B
Key Features
- Direct Heating Design: Apply heat directly through the stencil for faster, more efficient reballing — no indirect heating adapter required.
- 9×9 Ball Grid: Precisely machined 9×9 pitch layout matches the original BGA ball pattern of TU116-series GPUs for exact alignment.
- High-Precision Laser Cut: Uniform hole sizes ensure even solder ball distribution and a reliable joint after reflow.
- Durable Stainless Steel Construction: Resists warping and oxidation under repeated high-temperature use — built to last across multiple reballing sessions.
- New Condition: Ships brand new, ready for immediate professional use.
- BGA Package Type: Designed specifically for Drive IC / BGA-packaged GPU chips.
Product Specifications
| Application | Computer / GPU Chip Reballing |
| Compatible Chips | TU116-300-A1, TU116-400-A1, TU116-100-A1, TU116-150-KA-A1, TU116-250-KA-A1, N18P-G61, TU116, TU116B |
| Stencil Type | Direct Heating |
| Grid | 9×9 |
| Package Type | BGA |
| Type | Drive IC |
| Condition | New |
| Country of Origin | Made in Mainland China |
Who Is This For?
This stencil is ideal for electronics repair shops, GPU rework specialists, and advanced DIYers who need a dependable tool for reflowing or replacing solder balls on NVIDIA GTX 1660-series graphics cards and laptop GPU chips. Pair it with quality solder paste and a hot air rework station for best results.
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Frequently Asked Questions
Q: What does "direct heating" mean for a BGA reballing stencil?
A: A direct heating stencil allows your hot air gun or reflow station to apply heat directly through the stencil onto the solder balls. This speeds up the reballing process and reduces the need for additional adapter plates, making it a popular choice for professional GPU rework technicians.
Q: Is this stencil compatible with all GTX 1660 variants?
A: This stencil is compatible with TU116-300-A1, TU116-400-A1, TU116-100-A1, TU116-150-KA-A1, TU116-250-KA-A1, N18P-G61, TU116, and TU116B chip variants. Always verify your specific chip's ball pitch and layout before use to ensure a proper match.
Q: What tools do I need to use this BGA reballing stencil?
A: You will need a hot air rework station or reflow oven, quality lead-free or leaded solder paste, flux, and a chip holder/fixture to keep the stencil and GPU chip aligned during the process. A steady hand and prior BGA rework experience are also recommended for best results.
Q: Can this stencil be reused multiple times?
A: Yes. The stainless steel construction is designed to withstand repeated high-temperature cycles without warping or degrading. Proper cleaning after each use will help extend the stencil's lifespan significantly.