GDDR6 DDR6 FBGA180 Direct Heating BGA Stencil 90×90mm
GDDR6 DDR6 FBGA180 Direct Heating BGA Stencil 90×90mm
GDDR6 / DDR6 FBGA180 Direct Heating BGA Reballing Stencil – 90×90mm
Precision-engineered for professional BGA rework, this 90×90mm direct heating stencil is compatible with GDDR6 and DDR6 memory chips in the FBGA180 package. Designed to work with IC models including K4Z80325BC-HC14, K4Z80325BC-HC16, K4ZAF325BM-HC14, and K4ZAF325BM-HC16, this stencil delivers accurate solder ball placement every time — keeping your reballing workflow fast and reliable.
Made in Mainland China.
Key Features
- Direct Heating Design: Place directly on the chip during reballing — no separate holder required for compatible setups.
- 90×90mm Format: Standard size fits most BGA reballing stations and fixtures with ease.
- FBGA180 Precision Holes: Laser-cut apertures sized precisely for FBGA180-footprint GDDR6 / DDR6 memory ICs.
- Compatible Models: K4Z80325BC-HC14, K4Z80325BC-HC16, K4ZAF325BM-HC14, K4ZAF325BM-HC16.
- New Condition: Ships brand-new — clean, undamaged apertures for consistent solder ball transfers.
- SMD Package Application: Engineered for surface-mount device rework on computer memory modules and graphics cards.
Specifications
| Stencil Size | 90 × 90 mm |
| Chip Compatibility | K4Z80325BC-HC14 / HC16, K4ZAF325BM-HC14 / HC16 |
| Memory Type | GDDR6 / DDR6 |
| Package Type | FBGA180 |
| Stencil Type | Direct Heating |
| Package Format | SMD |
| Condition | New |
| Country of Origin | Mainland China |
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Frequently Asked Questions
Q: Which GPU or memory chip models is this GDDR6 FBGA180 stencil compatible with?
A: This direct heating BGA stencil is specifically designed for GDDR6 and DDR6 memory chips in the FBGA180 package, including models K4Z80325BC-HC14, K4Z80325BC-HC16, K4ZAF325BM-HC14, and K4ZAF325BM-HC16. These are commonly found on graphics cards and high-performance computing modules.
Q: What does "direct heating" mean for a BGA reballing stencil?
A: A direct heating stencil is placed directly onto the chip or PCB pad and heated alongside it during the reballing process. This allows solder balls to be placed and reflowed in a single step without needing a separate stencil holder, making the rework process faster and more efficient for experienced technicians.
Q: What size is this BGA stencil?
A: The stencil measures 90×90mm, which is a standard size compatible with most BGA reballing fixtures and stations used in professional electronics repair workshops.
Q: Is this stencil suitable for beginners?
A: This stencil is designed for use by electronics repair technicians familiar with BGA reballing and SMD rework processes. A basic understanding of hot-air or infrared reflow equipment and solder ball application is recommended for best results.