Direct Heating BGA Stencil – SRKZX SRL01 SRM8M Drive IC
Direct Heating BGA Stencil – SRKZX SRL01 SRM8M Drive IC
Direct Heating BGA Reballing Stencil for Drive IC Chips
This precision-cut direct heating BGA stencil is designed for professional and DIY chip reballing on a wide range of Drive IC models. Compatible with SRKZX, SRKZZ, SRKZY, SRKZW, SRL01, SRL2T, SRL2R, SRL2Y, SRKLR, SRL2Z, SRKLS, SRM8M, SRM8P, SRM8V, SRL53, SRM8T, and SRM2F chipsets, this stencil makes solder ball placement fast, accurate, and repeatable.
Whether you're a seasoned electronics repair technician or a skilled hobbyist working on computer motherboard repairs, this BGA stencil delivers consistent results every time. The direct heating design means you can place solder balls and reflow directly without needing a separate reballing station — saving you time and effort.
Made in Mainland China.
Key Features
- Wide Compatibility: Fits all listed Drive IC models including SRKZX, SRKZZ, SRKZY, SRKZW, SRL01, SRL2T, SRL2R, SRL2Y, SRKLR, SRL2Z, SRKLS, SRM8M, SRM8P, SRM8V, SRL53, SRM8T, and SRM2F
- Direct Heating Design: Apply solder flux and reflow directly — no separate reballing jig required
- BGA Package: Laser-cut apertures engineered for precise solder ball alignment
- Drive IC Application: Purpose-built for computer chip reballing and rework
- New Condition: Ships brand new, ready for immediate use
- No High-Concern Chemicals: Safe for everyday workshop use
What's in the Box?
- 1× Direct Heating BGA Reballing Stencil
Who Is This For?
Perfect for electronics repair shops, computer technicians, and advanced hobbyists who regularly reball BGA chips on laptop and desktop motherboards. If you work with the listed Drive IC chipsets, this stencil is an essential addition to your repair toolkit.
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Frequently Asked Questions
Q: What chip models is this direct heating BGA stencil compatible with?
A: This stencil is compatible with the following Drive IC models: SRKZX, SRKZZ, SRKZY, SRKZW, SRL01, SRL2T, SRL2R, SRL2Y, SRKLR, SRL2Z, SRKLS, SRM8M, SRM8P, SRM8V, SRL53, SRM8T, and SRM2F. Please verify your chip model before purchasing.
Q: What does "direct heating" mean for a BGA stencil?
A: A direct heating BGA stencil allows you to place solder balls on the chip and apply heat directly through the stencil to reflow them in one step. This eliminates the need for a dedicated reballing jig, making the process faster and more convenient for technicians.
Q: Is this stencil suitable for beginners?
A: While this BGA stencil is straightforward to use, BGA reballing does require some experience with soldering and electronics rework. It is best suited for professional repair technicians or advanced hobbyists familiar with chip-level motherboard repair.
Q: Where is this product made?
A: This direct heating BGA stencil is made in Mainland China.