Direct Heating BGA Stencil GM204 GK104 N14E GPU Reballing 90×90
Direct Heating BGA Stencil GM204 GK104 N14E GPU Reballing 90×90
Direct Heating BGA Reballing Stencil for GM204 & GK104 GPU Chips
Achieve precise, professional GPU reballing results with this high-quality 90×90mm direct heating BGA stencil. Engineered for compatibility with a wide range of NVIDIA GPU packages — including GM204-200-A1, GM204-400-A1, GK104-355-A2, GK104-425-A2, GK104-200-KA-A2, N14E-GT-W-A2, and N13E-GR-A2 — this stencil makes chip-level rework clean, repeatable, and reliable for electronics repair technicians and hobbyists alike.
Made in Mainland China.
Key Features
- Universal 90×90mm Format — Fits standard BGA reballing stations and fixtures for a secure, stable hold during the reflow process.
- Multi-GPU Compatibility — Supports GM204, GK104, N14E-GT-W, and N13E-GR GPU packages in a single stencil, reducing the need for multiple tools.
- Direct Heating Design — Allows hot-air or infrared heat to pass through efficiently for even solder ball placement and consistent reflow results.
- Laser-Cut Precision — Accurately aligned apertures ensure correct solder ball positioning every time, minimising bridging and rework errors.
- New Condition — Supplied brand new for professional-grade performance right out of the box.
- Drive IC / BGA Package Type — Specifically designed for BGA (Ball Grid Array) chip rework on computer graphics cards and laptop motherboards.
Compatible GPU Models
- GM204-200-A1
- GM204-400-A1
- GK104-355-A2
- GK104-425-A2
- GK104-200-KA-A2
- N14E-GT-W-A2
- N13E-GR-A2
Specifications
| Stencil Size | 90 × 90 mm |
| Type | Direct Heating BGA Stencil |
| Package | BGA (Ball Grid Array) |
| Application | Computer GPU / Graphics Card Reballing |
| Condition | New |
| Origin | Mainland China |
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Frequently Asked Questions
Q: Which GPU chips is this direct heating BGA stencil compatible with?
A: This 90×90mm BGA reballing stencil is compatible with GM204-200-A1, GM204-400-A1, GK104-355-A2, GK104-425-A2, GK104-200-KA-A2, N14E-GT-W-A2, and N13E-GR-A2 GPU packages — covering a broad range of NVIDIA graphics chip rework needs.
Q: What is a direct heating BGA stencil and how is it used?
A: A direct heating BGA stencil is a precision laser-cut metal template used in the GPU reballing process. It is placed over the chip to guide solder balls into the correct positions. Heat from a hot-air gun or infrared reflow station is applied directly through the stencil apertures, allowing the solder balls to settle and bond accurately — ideal for graphics card and laptop motherboard repair.
Q: Will this stencil fit standard BGA reballing stations?
A: Yes. The 90×90mm format is a widely used standard size compatible with most common BGA reballing fixtures and stations available in professional electronics repair workshops.