Direct Heating BGA Stencil 90×90mm – N18P-G0 G61 G62 GPU
Direct Heating BGA Stencil 90×90mm – N18P-G0 G61 G62 GPU
Direct Heating BGA Reballing Stencil – N18P Series | 90×90mm
Give your GPU chip reballing work the precision it deserves. This 90×90mm direct heating BGA reballing stencil is purpose-made for a wide range of NVIDIA N18P-series chips, including N18P-G0-A1, N18P-G0-MP-A1, N18P-GO-A1, N18P-GO-MP-A1, N18P-G61-A1, N18P-G62-A1, and N18P-G61-MP-A1. Whether you are a professional laptop repair technician or an experienced electronics hobbyist, this stencil delivers clean, accurate solder ball placement every time.
Key Features
- Precise Fit: Laser-cut openings engineered to match the exact ball pitch and layout of N18P-series GPU chips.
- 90×90mm Format: Standard direct-heating stencil size compatible with most BGA reballing stations and fixtures.
- Direct Heating Ready: Designed to sit directly over the chip on the PCB — no separate holder frame required for most setups.
- Wide Compatibility: Covers multiple N18P variants — G0, GO, G61, G62 — including standard and MP (Mobile Performance) die revisions.
- Durable Stainless Steel Construction: Maintains shape and flatness through repeated uses and high-temperature sessions.
- New Condition: Supplied brand new, ensuring clean openings free from solder residue.
- SMD Package Optimized: Sized and etched for SMD-type BGA chip footprints.
Compatible Chip Models
- N18P-G0-A1
- N18P-G0-MP-A1
- N18P-GO-A1
- N18P-GO-MP-A1
- N18P-G61-A1
- N18P-G62-A1
- N18P-G61-MP-A1
Specifications
| Stencil Size | 90 × 90 mm |
| Type | Direct Heating BGA Stencil |
| Application | Laptop / Computer GPU Reballing |
| Package Style | SMD (BGA) |
| Condition | New |
| Country of Origin | Made in China |
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Frequently Asked Questions
Q: What GPU chips is this direct heating stencil compatible with?
A: This 90×90mm BGA reballing stencil is compatible with NVIDIA N18P-series chips including N18P-G0-A1, N18P-G0-MP-A1, N18P-GO-A1, N18P-GO-MP-A1, N18P-G61-A1, N18P-G62-A1, and N18P-G61-MP-A1 — covering both standard and Mobile Performance (MP) die variants.
Q: Do I need a separate stencil holder frame to use this stencil?
A: This is a direct heating stencil, meaning it is designed to be placed directly over the chip on the PCB during the reballing process — most setups do not require a separate holder frame. However, compatibility may vary depending on your specific reballing station, so please verify with your equipment specifications before use.
Q: How many times can this BGA stencil be reused?
A: The stencil is constructed from durable stainless steel, which maintains its shape and flatness through multiple high-temperature reballing sessions. With proper cleaning and careful handling after each use, it can be reused many times, making it an economical choice for professional repair workflows.
Q: What size is this reballing stencil?
A: The stencil measures 90×90mm, which is a standard direct-heating format compatible with most BGA reballing stations and fixtures used in laptop and computer GPU repair.