DDR5 90×90 Direct Heating BGA Stencil D9TCB D9SXC D9SSX
DDR5 90×90 Direct Heating BGA Stencil D9TCB D9SXC D9SSX
DDR5 90×90 Direct Heating BGA Reballing Stencil
Get precise, professional-grade BGA reballing results with this 90×90mm Direct Heating Stencil designed specifically for DDR5 memory chips. Compatible with a wide range of popular DDR5 chip models, this stencil is an essential tool for electronics repair technicians, rework specialists, and hobbyists who demand accuracy and repeatability.
Compatible Chip Models
- D9TCB
- D9SXC
- D9SXD
- D9SSX
- D9VVQ
- D9VVR
- K4G41325FC-HC03
- K4G41325FC-HC04
- K4G41325FE-HC25
- K4G41325FE-HC28
Key Features
- Direct Heating Design: Allows solder balls to be applied directly on the chip without the need for a separate reballing platform, saving time and simplifying your workflow.
- 90×90mm Size: Perfectly sized for DDR5 BGA memory packages, ensuring full pad coverage and alignment.
- Laser-Cut Precision: Fine, clean apertures ensure accurate solder ball placement, reducing the risk of bridging or misalignment.
- Durable Construction: Made from high-quality stencil steel for long-lasting use across multiple reballing sessions.
- New Condition: Ships brand new, ready for immediate professional use.
- BGA Package Compatible: Designed to work with standard BGA solder ball sizes used in DDR5 computer memory chips.
What's in the Box
- 1 × 90×90mm DDR5 Direct Heating BGA Reballing Stencil
Specifications
| Size | 90 × 90 mm |
| Type | Direct Heating BGA Stencil |
| Application | DDR5 Computer Memory Chips |
| Package Type | BGA |
| Condition | New |
| Country of Origin | Made in Mainland China |
Related Tools & Products
Looking for more repair and DIY tools? Check out these products from our store:
- Air Compressor Pressure Gauge 0-10/0-12/0-25 Bar | DIY Tool
- Electromagnetic Induction Tester – Coil & Circuit Fault Detector
Learn more: OSHA guidance on hand and power tools
Frequently Asked Questions
Q: What DDR5 chip models is this BGA stencil compatible with?
A: This 90×90mm direct heating BGA stencil is compatible with DDR5 memory chips including D9TCB, D9SXC, D9SXD, D9SSX, D9VVQ, D9VVR, K4G41325FC-HC03, K4G41325FC-HC04, K4G41325FE-HC25, and K4G41325FE-HC28. Always verify your chip model before ordering.
Q: What is a direct heating BGA stencil and how is it used?
A: A direct heating BGA stencil is a precision laser-cut metal template placed directly on top of the chip. Solder balls or solder paste are then applied through the apertures while heat is applied, allowing for accurate and efficient reballing of BGA memory chips without the need for a separate holder or jig.
Q: Is this stencil reusable?
A: Yes. This stencil is constructed from durable stencil steel and can be cleaned and reused across multiple reballing sessions, making it a cost-effective addition to any electronics repair toolkit.
Q: What solder ball size should I use with this stencil?
A: This stencil is designed for standard BGA solder ball sizes used with DDR5 memory packages. We recommend consulting your chip's datasheet or a BGA reballing reference guide to confirm the correct ball size for your specific chip model.