{"product_id":"cpu-ic-chip-tin-planting-silicone-pad-bga-reball-repair-tool","title":"CPU IC Chip Tin-Planting Silicone Pad | BGA Reball Repair Tool","description":"\n\u003ch2\u003eProfessional CPU IC Chip Tin-Planting Silicone Pad for Mobile Phone Repair\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003ePD-C Tin-Planting Silicone Pad\u003c\/strong\u003e is an essential tool for professional mobile phone and electronics repair technicians. Designed to work seamlessly with BGA steel mesh stencils, this high-temperature insulation pad provides a stable, non-slip surface for precise tin-planting (reballing) of CPU chips, IC chips, and Drive ICs. Whether you're reballing smartphone motherboards, tablet processors, or other SMD components, this pad delivers consistent, reliable results every time.\u003c\/p\u003e\n\n\u003ch3\u003eKey Features\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\n\u003cstrong\u003eHigh-Temperature Resistance:\u003c\/strong\u003e Made from premium silicone that withstands the heat generated during soldering and tin-planting processes, keeping your workstation safe and components protected.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eNon-Slip Surface:\u003c\/strong\u003e The silicone construction grips your steel mesh stencil and PCB firmly in place, reducing movement and improving accuracy during the reballing process.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eUniversal Compatibility:\u003c\/strong\u003e Compatible with a wide range of BGA IC chips, CPU chips, and Drive ICs used in mobile phones, tablets, and computers.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eInsulating Properties:\u003c\/strong\u003e Provides effective electrical and thermal insulation, protecting sensitive components from damage during repair.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eDurable \u0026amp; Reusable:\u003c\/strong\u003e Built to last through repeated use across multiple repair sessions without degrading in performance.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eCompact \u0026amp; Portable:\u003c\/strong\u003e Lightweight design fits neatly into any repair toolkit for use in professional workshops or on-the-go repairs.\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eSpecifications\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\n\u003cstrong\u003eType:\u003c\/strong\u003e Drive IC \/ BGA Tin-Planting Pad\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003ePackage:\u003c\/strong\u003e SMD\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eCondition:\u003c\/strong\u003e New\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eQuantity:\u003c\/strong\u003e 1 Pad\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eApplication:\u003c\/strong\u003e Mobile Phone, Tablet, Computer PCB Repair\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eMade in:\u003c\/strong\u003e Mainland China\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eWhat's in the Box?\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e1 × PD-C Tin-Planting High-Temperature Insulation Silicone Pad\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eWho Is This For?\u003c\/h3\u003e\n\u003cp\u003eThis silicone tin-planting pad is ideal for \u003cstrong\u003eprofessional repair technicians, electronics hobbyists, and PCB repair enthusiasts\u003c\/strong\u003e who need a reliable, heat-resistant surface for BGA chip reballing and soldering tasks. It pairs perfectly with BGA steel mesh stencils and solder balls to complete a full reballing workstation setup.\u003c\/p\u003e\n\n\u003ch3\u003eRelated Products You May Like\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\u003ca href=\"\/products\/electromagnetic-induction-tester-coil-motherboard-fault-detector\"\u003eElectromagnetic Induction Tester – Coil \u0026amp; Circuit Fault Detector\u003c\/a\u003e\u003c\/li\u003e\n  \u003cli\u003e\u003ca href=\"\/products\/air-compressor-pressure-gauge-0-10-0-12-0-25-bar-hydraulic-diy\"\u003eAir Compressor Pressure Gauge 0-10\/0-12\/0-25 Bar | DIY Tool\u003c\/a\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003cp\u003eLearn more: \u003ca href=\"https:\/\/www.osha.gov\/personal-protective-equipment\" target=\"_blank\" rel=\"noopener\"\u003eOSHA on personal protective equipment\u003c\/a\u003e\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003ch4\u003eQ: What is the PD-C Tin-Planting Silicone Pad used for?\u003c\/h4\u003e\n\u003cp\u003eA: This silicone pad is used as a stable, non-slip, heat-resistant work surface during BGA chip reballing and tin-planting procedures. It supports CPU chips, IC chips, and Drive ICs while you apply solder balls using a steel mesh stencil, making the reballing process more accurate and efficient.\u003c\/p\u003e\n\u003ch4\u003eQ: Is this pad compatible with all BGA stencils and chip sizes?\u003c\/h4\u003e\n\u003cp\u003eA: The PD-C silicone pad is designed for broad compatibility with a wide variety of BGA IC chips and steel mesh stencils used in mobile phone, tablet, and computer repair. Always verify your specific chip size and stencil dimensions before purchase to ensure a proper fit.\u003c\/p\u003e\n\u003ch4\u003eQ: How do I clean and maintain the silicone pad?\u003c\/h4\u003e\n\u003cp\u003eA: After each use, gently wipe the surface with isopropyl alcohol and a lint-free cloth to remove any flux residue or solder debris. Avoid using abrasive tools or harsh chemicals that could damage the silicone surface. Proper care will extend the pad's lifespan across many repair sessions.\u003c\/p\u003e\n\u003ch4\u003eQ: Can this silicone pad withstand high soldering temperatures?\u003c\/h4\u003e\n\u003cp\u003eA: Yes. The pad is constructed from high-quality silicone specifically rated for high-temperature resistance, making it suitable for use during typical BGA reballing and soldering workflows. It insulates your work surface from heat, protecting both your bench and surrounding components.\u003c\/p\u003e\n\n\u003cscript type=\"application\/ld+json\"\u003e{\"@context\": \"https:\/\/schema.org\", \"@type\": \"FAQPage\", \"mainEntity\": [{\"@type\": \"Question\", \"name\": \"What is the PD-C Tin-Planting Silicone Pad used for?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"This silicone pad is used as a stable, non-slip, heat-resistant work surface during BGA chip reballing and tin-planting procedures. 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