CPU IC Chip Tin-Planting Silicone Pad | BGA Reball Repair Tool
CPU IC Chip Tin-Planting Silicone Pad | BGA Reball Repair Tool
Professional CPU IC Chip Tin-Planting Silicone Pad for Mobile Phone Repair
The PD-C Tin-Planting Silicone Pad is an essential tool for professional mobile phone and electronics repair technicians. Designed to work seamlessly with BGA steel mesh stencils, this high-temperature insulation pad provides a stable, non-slip surface for precise tin-planting (reballing) of CPU chips, IC chips, and Drive ICs. Whether you're reballing smartphone motherboards, tablet processors, or other SMD components, this pad delivers consistent, reliable results every time.
Key Features
- High-Temperature Resistance: Made from premium silicone that withstands the heat generated during soldering and tin-planting processes, keeping your workstation safe and components protected.
- Non-Slip Surface: The silicone construction grips your steel mesh stencil and PCB firmly in place, reducing movement and improving accuracy during the reballing process.
- Universal Compatibility: Compatible with a wide range of BGA IC chips, CPU chips, and Drive ICs used in mobile phones, tablets, and computers.
- Insulating Properties: Provides effective electrical and thermal insulation, protecting sensitive components from damage during repair.
- Durable & Reusable: Built to last through repeated use across multiple repair sessions without degrading in performance.
- Compact & Portable: Lightweight design fits neatly into any repair toolkit for use in professional workshops or on-the-go repairs.
Specifications
- Type: Drive IC / BGA Tin-Planting Pad
- Package: SMD
- Condition: New
- Quantity: 1 Pad
- Application: Mobile Phone, Tablet, Computer PCB Repair
- Made in: Mainland China
What's in the Box?
- 1 × PD-C Tin-Planting High-Temperature Insulation Silicone Pad
Who Is This For?
This silicone tin-planting pad is ideal for professional repair technicians, electronics hobbyists, and PCB repair enthusiasts who need a reliable, heat-resistant surface for BGA chip reballing and soldering tasks. It pairs perfectly with BGA steel mesh stencils and solder balls to complete a full reballing workstation setup.
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Frequently Asked Questions
Q: What is the PD-C Tin-Planting Silicone Pad used for?
A: This silicone pad is used as a stable, non-slip, heat-resistant work surface during BGA chip reballing and tin-planting procedures. It supports CPU chips, IC chips, and Drive ICs while you apply solder balls using a steel mesh stencil, making the reballing process more accurate and efficient.
Q: Is this pad compatible with all BGA stencils and chip sizes?
A: The PD-C silicone pad is designed for broad compatibility with a wide variety of BGA IC chips and steel mesh stencils used in mobile phone, tablet, and computer repair. Always verify your specific chip size and stencil dimensions before purchase to ensure a proper fit.
Q: How do I clean and maintain the silicone pad?
A: After each use, gently wipe the surface with isopropyl alcohol and a lint-free cloth to remove any flux residue or solder debris. Avoid using abrasive tools or harsh chemicals that could damage the silicone surface. Proper care will extend the pad's lifespan across many repair sessions.
Q: Can this silicone pad withstand high soldering temperatures?
A: Yes. The pad is constructed from high-quality silicone specifically rated for high-temperature resistance, making it suitable for use during typical BGA reballing and soldering workflows. It insulates your work surface from heat, protecting both your bench and surrounding components.