BGA Stencil Ryzen 7 6800U & 6850U Direct Heating 0.45mm 90x90

BGA Reballing Stencil for AMD Ryzen 7 6800U & Ryzen 7 PRO 6850U – 90×90mm, 0.45mm Direct Heating

This precision-cut 0.45mm direct heating BGA reballing stencil is designed for AMD Ryzen 7 6800U (100-000000534) and AMD Ryzen 7 PRO 6850U (100-000000562) processors. Whether you're a professional board-level technician or an experienced DIY repair enthusiast, this stencil ensures accurate solder ball placement for reliable laptop and computer motherboard rework.

Key Features

• Compatibility: AMD Ryzen 7 6800U (100-000000534) & Ryzen 7 PRO 6850U (100-000000562)
• Stencil Size: 90 × 90 mm – fits standard reballing fixtures and holders
• Thickness: 0.45mm for consistent, accurate solder ball deposition
• Type: Direct heating stencil – no need for a separate tin planting platform
• Package Type: BGA (Ball Grid Array)
• Condition: Brand new
• Application: Laptop / desktop computer motherboard repair and rework

Why Choose a Direct Heating Stencil?

Direct heating BGA stencils are placed directly on the chip and heated together, eliminating the need for a separate planting tin platform. This results in faster workflow, cleaner solder ball alignment, and more consistent results — ideal for high-volume repair shops and precision bench work alike.

What's in the Box?

• 1 × 90×90mm BGA Reballing Stencil (0.45mm, Direct Heating)

Made in Mainland China.

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Frequently Asked Questions

Q: What processors is this BGA reballing stencil compatible with?

A: This direct heating stencil is specifically designed for the AMD Ryzen 7 6800U (part number 100-000000534) and AMD Ryzen 7 PRO 6850U (part number 100-000000562) BGA processors used in laptops and compact computers.

Q: What does "direct heating" mean for a BGA stencil?

A: A direct heating BGA stencil is placed directly on top of the chip pads. Heat is applied through the stencil itself to melt and deposit the solder balls, eliminating the need for a separate tin-planting platform. This simplifies the reballing process and can improve accuracy and speed.

Q: What size and thickness is this stencil?

A: The stencil measures 90 × 90 mm and has a thickness of 0.45mm, which is the standard for precise solder ball placement on AMD Ryzen series BGA packages.

Q: Is this stencil suitable for beginners?

A: BGA reballing is an advanced soldering skill. This stencil is best suited for professional repair technicians or experienced electronics hobbyists with proper BGA rework equipment such as a hot air rework station or infrared reflow system.