BGA Solder Ball Stencil CXD2996AGB 90×90mm 0.6mm Direct Heat
BGA Solder Ball Stencil CXD2996AGB 90×90mm 0.6mm Direct Heat
BGA Solder Ball Stencil – CXD2996AGB / CXD2996 | 90×90mm | 0.6mm Pitch
Achieve clean, precise BGA reballing results with this direct-heating solder ball stencil, purpose-built for the CXD2996AGB / CXD2996 game console chip. Designed at an industry-standard 90×90mm footprint with a 0.6mm ball pitch, this stencil ensures accurate ball placement every time — making it a must-have for electronics repair technicians and hobbyists working on game console board-level repairs.
Made in Mainland China.
Key Features
- Direct Heating Design: Compatible with direct-heating reballing stations for fast, efficient workflow
- Precise 0.6mm Pitch: Laser-cut apertures ensure consistent ball sizing and accurate placement on the CXD2996AGB / CXD2996 chip
- 90×90mm Stencil Size: Standard format fits most universal reballing jigs and fixtures
- High-Quality Stainless Steel: Durable construction resists warping under repeated heating cycles
- Condition: New – Each stencil ships fresh and ready to use
- Quantity: 1 stencil per order
Specifications
- Compatible Chip: CXD2996AGB / CXD2996
- Stencil Size: 90 × 90mm
- Ball Pitch: 0.6mm
- Heating Type: Direct Heating
- Material: Stainless Steel
- Package Type: SMD
- Origin: Mainland China
Who Is This For?
Whether you're a professional electronics repair technician or a dedicated DIY hobbyist, this BGA stencil streamlines the reballing process for game console motherboards. It removes guesswork from ball placement and helps you achieve clean, reliable solder joints on the CXD2996AGB chip with minimal effort.
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Frequently Asked Questions
Q: What chip is this BGA solder ball stencil compatible with?
A: This direct-heating BGA stencil is specifically designed for the CXD2996AGB / CXD2996 game console chip. The 90×90mm size and 0.6mm ball pitch are precisely matched to this chip's BGA footprint for accurate reballing.
Q: What type of reballing station is required for this stencil?
A: This is a direct-heating stencil, meaning it is compatible with direct-heating BGA reballing stations or jigs that apply heat from below the stencil. It is not designed for infrared-only or indirect heating setups.
Q: Is this stencil reusable?
A: Yes. Made from durable stainless steel, this BGA stencil is designed to withstand multiple heating cycles without warping, making it suitable for repeated professional use.
Q: What ball size should I use with this 0.6mm stencil?
A: For a 0.6mm pitch BGA stencil like this one, standard 0.3mm or 0.35mm solder balls are typically used. Always verify the exact ball diameter specified for the CXD2996AGB chip before reballing.