{"product_id":"bga-reballing-stencil-samsung-a33-a53-a13-exynos-cpu-ram-ic","title":"BGA Reballing Stencil Samsung A33 A53 A13 Exynos CPU RAM IC","description":"\u003ch2\u003eBGA Reballing Stencil for Samsung Galaxy Series – Exynos CPU, RAM, EMMC \u0026amp; IC\u003c\/h2\u003e\n\u003cp\u003eAchieve precise, professional-grade BGA reballing results with this dedicated stencil kit designed for Samsung Galaxy smartphones. Whether you're reworking Exynos1280, E8825, Exynos850, or 3830 chipsets — including CPU, RAM (DDR), EMMC, RF, and Power ICs — this stencil delivers the accuracy and consistency that mobile board repair technicians demand.\u003c\/p\u003e\n\n\u003cp\u003eMade in Mainland China.\u003c\/p\u003e\n\n\u003ch3\u003eCompatible Chipsets \u0026amp; ICs\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003eExynos1280 (E8825)\u003c\/li\u003e\n  \u003cli\u003eExynos850 (3830)\u003c\/li\u003e\n  \u003cli\u003eCPU, RAM (DDR), EMMC\u003c\/li\u003e\n  \u003cli\u003eRF IC \u0026amp; Power IC\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eCompatible Samsung Models\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003eSamsung Galaxy A33\u003c\/li\u003e\n  \u003cli\u003eSamsung Galaxy A53 \/ A536\u003c\/li\u003e\n  \u003cli\u003eSamsung Galaxy A13\u003c\/li\u003e\n  \u003cli\u003eSamsung Galaxy A21S\u003c\/li\u003e\n  \u003cli\u003eSamsung Galaxy F13\u003c\/li\u003e\n  \u003cli\u003eSamsung Galaxy M33\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eKey Features\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\n\u003cstrong\u003ePrecision-Engineered:\u003c\/strong\u003e Laser-cut apertures aligned to exact BGA pad layouts for each supported chipset — no guesswork, no misalignment.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eDurable Construction:\u003c\/strong\u003e Made from high-quality stainless steel for long-lasting use across multiple rework sessions.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eClean Solder Ball Placement:\u003c\/strong\u003e Uniform ball distribution ensures consistent solder joints every time, minimizing the risk of bridging or cold joints.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eSlim \u0026amp; Stable Profile:\u003c\/strong\u003e Sits flush and secure during the tinning process for effortless handling.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eProfessional Grade:\u003c\/strong\u003e Trusted by mobile phone repair shops, PCB rework technicians, and electronics hobbyists alike.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eCondition:\u003c\/strong\u003e Brand new.\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eWhat's in the Box\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e1 × BGA Reballing Stencil (model-specific)\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eWho Is This For?\u003c\/h3\u003e\n\u003cp\u003eThis stencil is ideal for mobile repair technicians, microsoldering professionals, and electronics engineers working on Samsung Galaxy board-level repairs. If you regularly reball or replace Exynos chipsets, power ICs, or memory modules on Samsung A-series and M-series devices, this is a must-have tool in your rework station setup.\u003c\/p\u003e\n\n\u003cp\u003eLooking for more tools and accessories for your repair workbench? Check out our \u003ca href=\"\/products\/electromagnetic-induction-tester-coil-motherboard-fault-detector\"\u003eElectromagnetic Induction Tester – Coil \u0026amp; Circuit Fault Detector\u003c\/a\u003e and our \u003ca href=\"\/products\/air-compressor-pressure-gauge-0-10-0-12-0-25-bar-hydraulic-diy\"\u003eAir Compressor Pressure Gauge – DIY Tool\u003c\/a\u003e to round out your toolkit.\u003c\/p\u003e\n\n\u003cp\u003eLearn more: \u003ca href=\"https:\/\/www.osha.gov\/personal-protective-equipment\" target=\"_blank\" rel=\"noopener\"\u003eOSHA on personal protective equipment\u003c\/a\u003e\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003ch4\u003eQ: Which Samsung models is this BGA reballing stencil compatible with?\u003c\/h4\u003e\n\u003cp\u003eA: This stencil is compatible with Samsung Galaxy A33, A53, A536, A13, A21S, F13, and M33 models, covering Exynos1280 (E8825), Exynos850 (3830), as well as CPU, RAM (DDR), EMMC, RF IC, and Power IC chip positions.\u003c\/p\u003e\n\u003ch4\u003eQ: What material is this BGA reballing stencil made from?\u003c\/h4\u003e\n\u003cp\u003eA: The stencil is constructed from precision laser-cut stainless steel, ensuring durability and accurate aperture alignment for consistent solder ball placement across multiple rework sessions.\u003c\/p\u003e\n\u003ch4\u003eQ: Is this stencil suitable for beginners in mobile board repair?\u003c\/h4\u003e\n\u003cp\u003eA: While BGA reballing requires a rework station and basic microsoldering knowledge, this stencil's precision alignment makes it straightforward to use for anyone familiar with the process. It is widely used by both professional technicians and experienced hobbyists.\u003c\/p\u003e\n\u003ch4\u003eQ: How many stencils are included in the package?\u003c\/h4\u003e\n\u003cp\u003eA: Each order includes 1 BGA reballing stencil specific to the Samsung chipsets and models listed.\u003c\/p\u003e\n\u003cscript type=\"application\/ld+json\"\u003e{\"@context\": \"https:\/\/schema.org\", \"@type\": \"FAQPage\", \"mainEntity\": [{\"@type\": \"Question\", \"name\": \"Which Samsung models is this BGA reballing stencil compatible with?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"This stencil is compatible with Samsung Galaxy A33, A53, A536, A13, A21S, F13, and M33 models, covering Exynos1280 (E8825), Exynos850 (3830), as well as CPU, RAM (DDR), EMMC, RF IC, and Power IC chip positions.\"}}, {\"@type\": \"Question\", \"name\": \"What material is this BGA reballing stencil made from?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"The stencil is constructed from precision laser-cut stainless steel, ensuring durability and accurate aperture alignment for consistent solder ball placement across multiple rework sessions.\"}}, {\"@type\": \"Question\", \"name\": \"Is this stencil suitable for beginners in mobile board repair?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"While BGA reballing requires a rework station and basic microsoldering knowledge, this stencil's precision alignment makes it straightforward to use for anyone familiar with the process. It is widely used by both professional technicians and experienced hobbyists.\"}}, {\"@type\": \"Question\", \"name\": \"How many stencils are included in the package?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"Each order includes 1 BGA reballing stencil specific to the Samsung chipsets and models listed.\"}}]}\u003c\/script\u003e\n\u003cscript type=\"application\/ld+json\"\u003e{\"@context\": \"https:\/\/schema.org\", \"@type\": \"BreadcrumbList\", \"itemListElement\": [{\"@type\": \"ListItem\", \"position\": 1, \"name\": \"Home\", \"item\": \"https:\/\/n8ande-60.myshopify.com\/\"}, {\"@type\": \"ListItem\", \"position\": 2, \"name\": \"Home page\", \"item\": \"https:\/\/n8ande-60.myshopify.com\/collections\/frontpage\"}, {\"@type\": \"ListItem\", \"position\": 3, \"name\": \"BGA Reballing Stencil Samsung A33 A53 A13 Exynos CPU RAM IC\", \"item\": \"https:\/\/n8ande-60.myshopify.com\/products\/bga-reballing-stencil-samsung-a33-a53-a13-exynos-cpu-ram-emmc-ic\"}]}\u003c\/script\u003e","brand":"Axl","offers":[{"title":"China Mainland","offer_id":43692649185341,"sku":"200007763:201336100","price":15.86,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0671\/3439\/0333\/files\/S3b9c5531a2224c5e80da8fc2a9cfd324R.webp?v=1790178014","url":"https:\/\/qtiply.com\/products\/bga-reballing-stencil-samsung-a33-a53-a13-exynos-cpu-ram-ic","provider":"QTP","version":"1.0","type":"link"}