BGA Reballing Stencil Samsung A33 A53 A13 Exynos CPU RAM IC
BGA Reballing Stencil Samsung A33 A53 A13 Exynos CPU RAM IC
BGA Reballing Stencil for Samsung Galaxy Series – Exynos CPU, RAM, EMMC & IC
Achieve precise, professional-grade BGA reballing results with this dedicated stencil kit designed for Samsung Galaxy smartphones. Whether you're reworking Exynos1280, E8825, Exynos850, or 3830 chipsets — including CPU, RAM (DDR), EMMC, RF, and Power ICs — this stencil delivers the accuracy and consistency that mobile board repair technicians demand.
Made in Mainland China.
Compatible Chipsets & ICs
- Exynos1280 (E8825)
- Exynos850 (3830)
- CPU, RAM (DDR), EMMC
- RF IC & Power IC
Compatible Samsung Models
- Samsung Galaxy A33
- Samsung Galaxy A53 / A536
- Samsung Galaxy A13
- Samsung Galaxy A21S
- Samsung Galaxy F13
- Samsung Galaxy M33
Key Features
- Precision-Engineered: Laser-cut apertures aligned to exact BGA pad layouts for each supported chipset — no guesswork, no misalignment.
- Durable Construction: Made from high-quality stainless steel for long-lasting use across multiple rework sessions.
- Clean Solder Ball Placement: Uniform ball distribution ensures consistent solder joints every time, minimizing the risk of bridging or cold joints.
- Slim & Stable Profile: Sits flush and secure during the tinning process for effortless handling.
- Professional Grade: Trusted by mobile phone repair shops, PCB rework technicians, and electronics hobbyists alike.
- Condition: Brand new.
What's in the Box
- 1 × BGA Reballing Stencil (model-specific)
Who Is This For?
This stencil is ideal for mobile repair technicians, microsoldering professionals, and electronics engineers working on Samsung Galaxy board-level repairs. If you regularly reball or replace Exynos chipsets, power ICs, or memory modules on Samsung A-series and M-series devices, this is a must-have tool in your rework station setup.
Looking for more tools and accessories for your repair workbench? Check out our Electromagnetic Induction Tester – Coil & Circuit Fault Detector and our Air Compressor Pressure Gauge – DIY Tool to round out your toolkit.
Learn more: OSHA on personal protective equipment
Frequently Asked Questions
Q: Which Samsung models is this BGA reballing stencil compatible with?
A: This stencil is compatible with Samsung Galaxy A33, A53, A536, A13, A21S, F13, and M33 models, covering Exynos1280 (E8825), Exynos850 (3830), as well as CPU, RAM (DDR), EMMC, RF IC, and Power IC chip positions.
Q: What material is this BGA reballing stencil made from?
A: The stencil is constructed from precision laser-cut stainless steel, ensuring durability and accurate aperture alignment for consistent solder ball placement across multiple rework sessions.
Q: Is this stencil suitable for beginners in mobile board repair?
A: While BGA reballing requires a rework station and basic microsoldering knowledge, this stencil's precision alignment makes it straightforward to use for anyone familiar with the process. It is widely used by both professional technicians and experienced hobbyists.
Q: How many stencils are included in the package?
A: Each order includes 1 BGA reballing stencil specific to the Samsung chipsets and models listed.