BGA Reballing Stencil QFN 77031 58255 78191 QMP5677 Hi6D05
BGA Reballing Stencil QFN 77031 58255 78191 QMP5677 Hi6D05
BGA Reballing Stencil for QFN Chips – Precision Rework Tool
Achieve clean, consistent ball grid array reballing every time with this professional-grade BGA Reballing Stencil. Designed specifically for QFN chip models including 77031, 58255, 78191, 53735, QMP5677, 540, and Hi6D05, this stencil is an essential tool for electronics repair technicians, smartphone repair shops, and PCB rework professionals.
Whether you're reworking mobile phone motherboards, computer chips, or embedded drive ICs, this stencil delivers repeatable precision for solder ball placement — saving time and reducing the risk of bridging or misalignment during the reballing process.
Key Features
- Compatible Chip Models: QFN 77031, 58255, 78191, 53735, QMP5677, 540, Hi6D05
- Application: Computer and mobile device chip rework & reballing
- Package Type: SMD (Surface Mount Device)
- Component Type: Drive IC
- Condition: Brand new
- Customized: Yes — precision-cut for the listed QFN chip models
- High-Concern Chemicals: None
Who Is This For?
This BGA reballing stencil is ideal for:
- Electronics repair technicians performing chip-level PCB rework
- Smartphone and tablet repair shops handling motherboard reballing
- Hobbyists and DIY electronics enthusiasts
- Computer repair professionals replacing or reflowing drive ICs
What's in the Package?
- 1 × BGA Reballing Stencil (for listed QFN chip models)
Made in Mainland China.
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Frequently Asked Questions
Q: Which chip models is this BGA reballing stencil compatible with?
A: This stencil is precision-cut for the following QFN chip models: 77031, 58255, 78191, 53735, QMP5677, 540, and Hi6D05. It is designed specifically for these drive IC packages, ensuring accurate solder ball placement during the reballing process.
Q: What type of reballing work is this stencil used for?
A: This BGA reballing stencil is used in chip-level PCB rework, primarily for computer and mobile device motherboard repair. It helps technicians precisely position solder balls on SMD drive IC chips during the reballing or reflowing process.
Q: Is this stencil reusable?
A: Yes. BGA reballing stencils like this one are designed for multiple uses. Proper cleaning after each use (removing excess solder flux) will help maintain the stencil's precision and extend its service life.