BGA Reballing Stencil MT6891Z MT6893Z MT6877V MT6833V Chips

Mi17 BGA Reballing Stencil – Precision IC Rework for MediaTek Chipsets

The Mi17 BGA Reballing Stencil is a professional-grade rework tool designed for technicians and electronics repair specialists working with MediaTek chipsets found in popular Redmi, POCO, and Xiaomi devices. Whether you're replacing solder balls on MT6891Z, MT6893Z, MT6877V, or MT6833V processors, this stencil delivers the accuracy and repeatability you need for clean, reliable BGA reballing results.

Made in Mainland China.

Compatible Chipsets & Devices

• MT6891Z / MT6893Z – Redmi Note 10 Pro, Redmi Note 11 Pro+
• MT6877V – Redmi Note 11SE / 11E / 11R, Redmi 12 Pro+
• MT6833V – Redmi K40, POCO M3 Pro, POCO M4 Pro

Key Features

• Precision-cut stencil: Laser-etched apertures align perfectly with BGA pad layouts for consistent solder ball placement
• Durable construction: Engineered to withstand repeated use across multiple reballing sessions
• Customized design: Tailored specifically to MediaTek IC footprints for zero-guesswork positioning
• SMD-compatible: Suitable for use in standard SMD rework stations and reballing kits
• New condition: Supplied brand new for reliable, uncompromised performance on every job
• Wide device coverage: Supports an extensive range of Redmi, POCO, and Xiaomi handsets in a single stencil

Who Is This For?

This BGA stencil is ideal for professional mobile phone repair technicians, electronics hobbyists, and BGA rework specialists who require a dependable, chip-specific reballing tool. It eliminates guesswork and reduces the risk of misaligned solder balls during IC replacement.

What's in the Box?

• 1 × Mi17 BGA Reballing Stencil (supports MT6891Z, MT6893Z, MT6877V, MT6833V)

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Frequently Asked Questions

Q: Which chipsets and devices is this BGA reballing stencil compatible with?

A: This stencil is specifically designed for MediaTek MT6891Z, MT6893Z, MT6877V, and MT6833V chipsets, covering devices such as Redmi Note 10, Redmi Note 10 Pro, Redmi Note 11 Pro+, Redmi Note 11SE/11E/11R, Redmi 12 Pro+, Redmi K40, POCO M3 Pro, and POCO M4 Pro.

Q: Is this BGA stencil reusable for multiple reballing sessions?

A: Yes. The Mi17 BGA reballing stencil is built from durable materials and is designed to be reused across multiple sessions without loss of precision, making it a cost-effective choice for professional repair technicians.

Q: Do I need any special equipment to use this BGA reballing stencil?

A: You will need a standard SMD rework station, BGA reballing kit (solder balls, flux, and a heat source such as a hot air gun or infrared rework station). The stencil slots into most standard reballing jig fixtures for easy setup.