BGA Reballing Stencil for Snapdragon SM8750 SM8650 SM8550 8Gen2
BGA Reballing Stencil for Snapdragon SM8750 SM8650 SM8550 8Gen2
BGA Reballing Stencil Template – Snapdragon SM Series Chipsets
Achieve precise, professional-grade BGA reballing results with this dedicated stencil template, designed specifically for Qualcomm Snapdragon SM-series processors. Whether you're a professional board-level repair technician or an advanced electronics hobbyist, this stencil ensures accurate solder ball placement every time — saving time and reducing rework errors on high-value mobile chipsets.
Compatible Chipsets
- Snapdragon SM8750 (8s Gen 3)
- Snapdragon SM8650 (8 Gen 3)
- Snapdragon SM8635
- Snapdragon SM8550 (8 Gen 2)
- Snapdragon SM8475 / SM8450 (8 Gen 1)
- Snapdragon SM8425
- Snapdragon SM7550 / SM7475
Key Features
- Precision-Laser-Cut: Accurately machined apertures match the exact BGA pad layout of each supported Snapdragon chipset for consistent solder ball transfer.
- Durable Construction: Made from high-quality stainless steel for long-lasting use across multiple reballing sessions.
- Correct Ball Pitch: Maintains proper ball pitch geometry to ensure solid solder joints and reliable chip re-attachment.
- Custom-Fit Design: Each stencil is tailored to the specific pad matrix of its corresponding chipset — no universal compromises.
- New Condition: Supplied brand new, ready to use straight from the packaging.
- Quantity: 1 stencil per order.
Who Is This For?
This BGA reballing stencil is ideal for:
- Mobile phone board-level repair shops and technicians
- Electronics engineers working on Qualcomm-based smartphones and tablets
- Advanced DIY repair enthusiasts tackling chipset-level soldering projects
What Is BGA Reballing?
Ball Grid Array (BGA) reballing is the process of removing a BGA chip from a PCB, cleaning the pads, applying new solder balls using a stencil, and re-soldering the chip. A correctly sized and precisely machined stencil is essential to this process — it guides the solder balls into the exact positions required by the chip's pad layout, ensuring a reliable electrical connection after reflow.
Made in Mainland China.
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Frequently Asked Questions
Q: Which Snapdragon chipsets is this BGA reballing stencil compatible with?
A: This stencil is compatible with a wide range of Qualcomm Snapdragon SM-series processors, including the SM8750, SM8650, SM8635, SM8550, SM8475, SM8450, SM8425, SM7550, and SM7475 — covering Snapdragon 8s Gen 3, 8 Gen 3, 8 Gen 2, and 8 Gen 1 generations.
Q: What material is the BGA reballing stencil made from?
A: The stencil is precision-laser-cut from durable stainless steel, designed to withstand repeated use across many reballing sessions without warping or losing dimensional accuracy.
Q: How many stencils are included per order?
A: Each order includes 1 BGA reballing stencil template. Please verify the specific chipset model you require before ordering to ensure you receive the correct stencil for your repair job.
Q: Is this stencil suitable for beginners?
A: BGA reballing is an advanced electronics repair technique that requires specialized equipment such as a hot air rework station, flux, and solder balls. This stencil is best suited for experienced technicians or advanced repair enthusiasts who are already familiar with the BGA reballing process.