BGA Reballing Stencil for DJI Drones – CPU EMMC DDR Repair
BGA Reballing Stencil for DJI Drones – CPU EMMC DDR Repair
BGA Reballing Solder Paste Stencil for DJI Drone Repair
Get precise, professional-grade BGA reballing results with this dedicated solder paste stencil designed specifically for DJI drone motherboard components. Whether you're a professional UAV repair technician or a skilled electronics hobbyist, this stencil delivers accurate solder paste placement for CPU, EMMC, and DDR chips found in popular DJI models.
Compatible with a wide range of DJI platforms including the E2TB, E3TB, Air 3, Mini 1, Mini 2, Mini 3, H3, H6, and P1 series, this stencil takes the guesswork out of chip-level rework and ensures consistent, repeatable results every time.
Made in Mainland China.
Key Features
- Precision-Engineered Apertures: Laser-cut openings sized and positioned exactly for DJI CPU, EMMC, and DDR BGA footprints — no guesswork, no bridging.
- Wide Compatibility: Fits DJI E2TB, E3TB, Air 3, Mini 1/2/3, H3, H6, and P1 chip packages in one stencil.
- Solder Paste Ready: Designed for standard no-clean solder pastes; apply, squeegee, and reflow with confidence.
- Durable Construction: Rigid stainless steel frame holds its shape under repeated use — ideal for high-volume repair workflows.
- Time-Saving Tool: Eliminates the need for manual solder ball placement; dramatically speeds up UAV board rework.
- Quantity: 1 stencil per order (customized SMD format).
What's in the Box
- 1 × BGA Reballing Solder Paste Stencil (DJI E2TB / E3TB / Air 3 / Mini 1-2-3 / H3 / H6 / P1)
Who Is This For?
This stencil is an essential addition to any UAV repair bench. It's ideal for electronics repair shops, drone service centers, and experienced DIY technicians performing chip-level rework on DJI flight controllers and image processing boards.
Related Tools You May Need
- Electromagnetic Induction Tester – Coil & Circuit Fault Detector — locate circuit faults before and after rework.
- Air Compressor Pressure Gauge 0-10/0-12/0-25 Bar | DIY Tool — keep your workbench tools running at the right pressure.
Learn more: OSHA on personal protective equipment
Frequently Asked Questions
Q: Which DJI drone models is this BGA reballing stencil compatible with?
A: This solder paste stencil is specifically designed for DJI E2TB, E3TB, Air 3, Mini 1, Mini 2, Mini 3, H3, H6, and P1 CPU, EMMC, and DDR chip packages. Always verify the exact chip footprint on your board before use.
Q: What type of solder paste should I use with this stencil?
A: This stencil is compatible with standard SMD no-clean solder pastes commonly used in BGA reballing and chip rework. We recommend using a paste with a particle size appropriate for the BGA pitch of your target chip (typically Type 3 or Type 4).
Q: Is this stencil reusable?
A: Yes. The stencil is made from durable stainless steel and can be cleaned with isopropyl alcohol (IPA) and reused multiple times, making it a cost-effective tool for regular UAV repair work.
Q: Is this a universal stencil or specific to one chip?
A: This is a customized stencil with apertures matched to specific DJI drone chip footprints (CPU, EMMC, DDR BGA packages). It is not a universal stencil — it is engineered for the listed DJI models to ensure precise solder paste deposition.