{"product_id":"bga-reballing-stencil-emmc-ufs-lpddr-nand-bga153-bga297","title":"BGA Reballing Stencil – eMMC UFS LPDDR NAND BGA153–BGA297","description":"\n\u003ch2\u003eBGA Reballing Stencil Template for eMMC, EMCP, UFS, UMCP, LPDDR \u0026amp; NAND Flash\u003c\/h2\u003e\n\u003cp\u003eGet professional-grade reballing results with this precision BGA Reballing Stencil Template, designed for a wide range of memory chip packages including eMMC, EMCP, UFS, UMCP, LPDDR, and NAND flash. Whether you're a board-level technician, electronics repair specialist, or hobbyist working on mobile devices and computers, this stencil delivers accurate solder ball placement every time.\u003c\/p\u003e\n\n\u003cp\u003e\u003cstrong\u003eCompatible BGA Packages:\u003c\/strong\u003e BGA153, BGA169, BGA221, BGA297, BGA254, BGA178, BGA200, BGA110, BGA186\u003c\/p\u003e\n\n\u003ch3\u003eKey Features\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\n\u003cstrong\u003eWide Compatibility:\u003c\/strong\u003e Supports multiple BGA footprints used in smartphones, tablets, laptops, and embedded systems — one stencil kit covers your most common chip packages.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003ePrecision Laser-Cut Apertures:\u003c\/strong\u003e Finely machined holes ensure uniform solder ball placement and consistent solder paste deposition for reliable reflow results.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eDurable Construction:\u003c\/strong\u003e Made from high-quality stainless steel for long-lasting performance and resistance to solder flux and heat during reballing operations.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eStable Flat Design:\u003c\/strong\u003e Flat stencil template lies flush to the PCB surface, minimizing alignment errors and improving yield rates on reballing work.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eVersatile Use:\u003c\/strong\u003e Ideal for eMMC chip replacement, UFS memory upgrades, LPDDR reballing, and NAND flash rework on phones, computers, and other electronics.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eReady to Use:\u003c\/strong\u003e Arrives clean and ready for immediate use straight from the package — no additional preparation required.\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eProduct Specifications\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\n\u003cstrong\u003eApplication:\u003c\/strong\u003e Computer \/ Mobile Device Board-Level Repair\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eCondition:\u003c\/strong\u003e New\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003ePackage Type:\u003c\/strong\u003e BGA (Ball Grid Array)\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eCompatible Packages:\u003c\/strong\u003e BGA153, BGA169, BGA221, BGA297, BGA254, BGA178, BGA200, BGA110, BGA186\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eCompatible Chip Types:\u003c\/strong\u003e eMMC, EMCP, UFS, UMCP, LPDDR, NAND\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eCountry of Origin:\u003c\/strong\u003e Made in China\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eWhat's in the Box\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e1 × BGA Reballing Stencil Template (multi-package)\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eRelated Products You May Like\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\u003ca href=\"\/products\/electromagnetic-induction-tester-coil-motherboard-fault-detector\"\u003eElectromagnetic Induction Tester – Coil \u0026amp; Circuit Fault Detector\u003c\/a\u003e\u003c\/li\u003e\n  \u003cli\u003e\u003ca href=\"\/products\/air-compressor-pressure-gauge-0-10-0-12-0-25-bar-hydraulic-diy\"\u003eAir Compressor Pressure Gauge 0-10\/0-12\/0-25 Bar | DIY Tool\u003c\/a\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003cp\u003eLearn more: \u003ca href=\"https:\/\/www.osha.gov\/eye-face-protection\" target=\"_blank\" rel=\"noopener\"\u003eOSHA on eye and face protection\u003c\/a\u003e\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003ch4\u003eQ: What BGA chip packages is this reballing stencil compatible with?\u003c\/h4\u003e\n\u003cp\u003eA: This BGA reballing stencil template is compatible with BGA153, BGA169, BGA221, BGA297, BGA254, BGA178, BGA200, BGA110, and BGA186 packages, covering popular eMMC, EMCP, UFS, UMCP, LPDDR, and NAND flash memory chips used in smartphones, tablets, and computers.\u003c\/p\u003e\n\u003ch4\u003eQ: Is this stencil suitable for beginners as well as professional technicians?\u003c\/h4\u003e\n\u003cp\u003eA: Yes. The flat, precision laser-cut stencil design makes it accessible for both experienced board-level repair technicians and hobbyists learning BGA reballing. Its stable design helps reduce misalignment and improves success rates even for those newer to the process.\u003c\/p\u003e\n\u003ch4\u003eQ: What material is the BGA reballing stencil made from?\u003c\/h4\u003e\n\u003cp\u003eA: The stencil is constructed from durable stainless steel, which withstands repeated exposure to solder flux and reflow heat, ensuring long service life across many reballing jobs.\u003c\/p\u003e\n\n\u003cscript type=\"application\/ld+json\"\u003e{\"@context\": \"https:\/\/schema.org\", \"@type\": \"FAQPage\", \"mainEntity\": [{\"@type\": \"Question\", \"name\": \"What BGA chip packages is this reballing stencil compatible with?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"This BGA reballing stencil template is compatible with BGA153, BGA169, BGA221, BGA297, BGA254, BGA178, BGA200, BGA110, and BGA186 packages, covering popular eMMC, EMCP, UFS, UMCP, LPDDR, and NAND flash memory chips used in smartphones, tablets, and computers.\"}}, {\"@type\": \"Question\", \"name\": \"Is this stencil suitable for beginners as well as professional technicians?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"Yes. 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