BGA Reballing Stencil – eMMC UFS LPDDR NAND BGA153–BGA297
BGA Reballing Stencil – eMMC UFS LPDDR NAND BGA153–BGA297
BGA Reballing Stencil Template for eMMC, EMCP, UFS, UMCP, LPDDR & NAND Flash
Get professional-grade reballing results with this precision BGA Reballing Stencil Template, designed for a wide range of memory chip packages including eMMC, EMCP, UFS, UMCP, LPDDR, and NAND flash. Whether you're a board-level technician, electronics repair specialist, or hobbyist working on mobile devices and computers, this stencil delivers accurate solder ball placement every time.
Compatible BGA Packages: BGA153, BGA169, BGA221, BGA297, BGA254, BGA178, BGA200, BGA110, BGA186
Key Features
- Wide Compatibility: Supports multiple BGA footprints used in smartphones, tablets, laptops, and embedded systems — one stencil kit covers your most common chip packages.
- Precision Laser-Cut Apertures: Finely machined holes ensure uniform solder ball placement and consistent solder paste deposition for reliable reflow results.
- Durable Construction: Made from high-quality stainless steel for long-lasting performance and resistance to solder flux and heat during reballing operations.
- Stable Flat Design: Flat stencil template lies flush to the PCB surface, minimizing alignment errors and improving yield rates on reballing work.
- Versatile Use: Ideal for eMMC chip replacement, UFS memory upgrades, LPDDR reballing, and NAND flash rework on phones, computers, and other electronics.
- Ready to Use: Arrives clean and ready for immediate use straight from the package — no additional preparation required.
Product Specifications
- Application: Computer / Mobile Device Board-Level Repair
- Condition: New
- Package Type: BGA (Ball Grid Array)
- Compatible Packages: BGA153, BGA169, BGA221, BGA297, BGA254, BGA178, BGA200, BGA110, BGA186
- Compatible Chip Types: eMMC, EMCP, UFS, UMCP, LPDDR, NAND
- Country of Origin: Made in China
What's in the Box
- 1 × BGA Reballing Stencil Template (multi-package)
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Frequently Asked Questions
Q: What BGA chip packages is this reballing stencil compatible with?
A: This BGA reballing stencil template is compatible with BGA153, BGA169, BGA221, BGA297, BGA254, BGA178, BGA200, BGA110, and BGA186 packages, covering popular eMMC, EMCP, UFS, UMCP, LPDDR, and NAND flash memory chips used in smartphones, tablets, and computers.
Q: Is this stencil suitable for beginners as well as professional technicians?
A: Yes. The flat, precision laser-cut stencil design makes it accessible for both experienced board-level repair technicians and hobbyists learning BGA reballing. Its stable design helps reduce misalignment and improves success rates even for those newer to the process.
Q: What material is the BGA reballing stencil made from?
A: The stencil is constructed from durable stainless steel, which withstands repeated exposure to solder flux and reflow heat, ensuring long service life across many reballing jobs.