BGA Reballing Solder Stencil – UNISOC UIS8910 UMS9230H UMS512T
BGA Reballing Solder Stencil – UNISOC UIS8910 UMS9230H UMS512T
BGA Reballing Solder Stencil for UNISOC Chipsets
This precision BGA reballing solder stencil is designed for professional electronics repair technicians and hobbyists working with UNISOC chipsets. Compatible with a wide range of UNISOC ICs including UIS8910, UIP8910, UMS9230H, UMS512T, R818, UMW2652, UMP510G5, and more, this stencil ensures accurate solder ball placement every time.
Whether you're reworking a mobile device motherboard or performing a BGA chip replacement, this stencil delivers consistent results with minimal effort — making it an essential tool for any electronics repair bench.
Key Features
- Wide Compatibility: Supports UNISOC UN1, UN2, UN3, U-UNI1, UIS8910, UIP8910, UMS9230H, UMS512T, R818, UMW2652, UMP510G5/254, and UMS512T chipsets.
- Precision Laser-Cut: Each opening is precisely cut to match the exact ball pitch and layout of the supported BGA packages, ensuring reliable solder ball placement.
- Professional Grade: Made from durable stainless steel for repeated use without warping or deformation.
- BGA Package Type: Designed specifically for BGA (Ball Grid Array) IC packages used in mobile and computing applications.
- New Condition: Supplied brand new for first-time, clean use.
- Compact & Easy to Use: Lightweight and designed to fit standard BGA reballing jigs and fixtures.
Specifications
- Application: Mobile / Computer IC Reballing
- Package Type: BGA
- Compatible Chips: UNISOC UN1, UN2, UN3, U-UNI1, UIS8910, UIP8910, UMS9230H, UMS512T, R818, UMW2652, UMP510G5/254
- Quantity: 1 Stencil
- Condition: New
- Country of Origin: Made in Mainland China
Ideal For
- Mobile phone and tablet motherboard repair
- BGA chip rework and reballing
- Electronics repair shops and technicians
- DIY electronics enthusiasts
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Frequently Asked Questions
Q: What UNISOC chipsets is this BGA reballing stencil compatible with?
A: This BGA reballing solder stencil is compatible with a wide range of UNISOC chipsets, including UN1, UN2, UN3, U-UNI1, UIS8910, UIP8910, UMS9230H, UMS512T, R818, UMW2652, UMP510G5/254, and UMS512T. Always verify the ball pitch and layout of your specific chip before use.
Q: Is this stencil reusable?
A: Yes. The stencil is crafted from durable stainless steel, which allows for multiple uses without warping or bending under normal reballing conditions. Proper cleaning after each use will extend its service life.
Q: What equipment do I need to use this BGA reballing stencil?
A: You will need a BGA reballing jig or fixture to hold the stencil in place, solder balls of the appropriate diameter for your chip, flux, and a hot air rework station or infrared reflow oven for the reballing process.
Q: Where is this product made?
A: This BGA reballing stencil is made in Mainland China.