BGA Leaded Solder Balls Reballing Kit – 0.2 to 0.76mm Sizes
BGA Leaded Solder Balls Reballing Kit – 0.2 to 0.76mm Sizes
BGA Leaded Solder Balls – Professional Reballing & Rework Kit
Keep your board-level repairs accurate and efficient with this bottle of BGA leaded solder balls. Available in a wide range of diameters — 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, and 0.76 mm — this kit covers virtually every BGA rework scenario, from fine-pitch smartphone chips to larger computer and console ICs. Whether you're a professional electronics technician or a dedicated hobbyist, having the right ball size on hand makes reballing faster and more reliable.
Key Features
- Wide Size Range: 11 diameter options (0.2 mm – 0.76 mm) in a single convenient bottle — choose the exact size your BGA component requires.
- Leaded Alloy Formula: Leaded solder composition offers excellent wetting performance and consistent reflow results on standard BGA rework stations.
- High Consistency: Uniform, precisely sized spheres ensure even joint formation and reduce the risk of bridging or cold solder joints.
- Broad Compatibility: Suitable for CPUs, GPUs, chipsets, and other BGA-packaged ICs found in computers, laptops, gaming consoles, and mobile devices.
- SMD Package Format: Packaged in a secure, easy-to-dispense bottle to minimise loss of small balls during use.
- New Condition: Each bottle is freshly supplied — no oxidation, no contamination.
Specifications
| Available Diameters | 0.2 / 0.25 / 0.3 / 0.35 / 0.4 / 0.45 / 0.5 / 0.55 / 0.6 / 0.65 / 0.76 mm |
| Type | Leaded BGA Solder Balls |
| Application | BGA Reballing, Rework & Repair |
| Package | 1 Bottle (SMD) |
| Condition | New |
| Country of Origin | Made in Mainland China |
What's in the Box?
- 1 × Bottle of BGA Leaded Solder Balls (selected diameter)
Related Products You May Need
- Electromagnetic Induction Tester – Coil & Circuit Fault Detector
- Air Compressor Pressure Gauge 0–25 Bar | DIY Tool
Learn more: OSHA on eye and face protection
Frequently Asked Questions
Q: What diameter BGA solder ball should I choose for my CPU or GPU reballing project?
A: The correct diameter depends on the specific BGA package specification of your chip. Most laptop CPUs and GPUs use 0.3–0.5 mm balls, while larger desktop or console chips may require 0.6–0.76 mm. Always refer to the component's datasheet or manufacturer's reballing stencil specification to confirm the correct ball size before starting your rework.
Q: Are these leaded BGA solder balls compatible with standard rework stations?
A: Yes. These leaded solder balls are designed to work with conventional BGA rework stations and hot-air systems that support standard leaded alloy reflow profiles. Their uniform spherical shape ensures consistent placement and reliable joint formation when used with the appropriate BGA reballing stencil.
Q: How many solder balls are included in one bottle?
A: The quantity per bottle varies depending on the selected diameter — smaller balls (e.g. 0.2 mm) naturally yield a higher count than larger sizes (e.g. 0.76 mm). Each bottle contains a generous quantity suitable for multiple reballing sessions. Select your required diameter at the time of purchase.