BGA Direct Heating Stencil – YM3700 YM370 YM250 YM3200 Series
BGA Direct Heating Stencil – YM3700 YM370 YM250 YM3200 Series
BGA Direct Heating Stencil – YM3700 / YM370 / YM250 / YM270 / YM3200 / YM3050 / YM3500 Series
Achieve precise, professional BGA reballing results with this dedicated Direct Heating Stencil. Engineered specifically for a wide range of YM-series Drive ICs, this stencil ensures accurate solder ball placement every time — making it an essential tool for laptop and computer motherboard repair technicians.
Made in Mainland China.
Compatible Chipset Models
- YM3700C4TMFG
- YM370BC4T4MFG
- YM250BC4T4MFB
- YM270BC4T4MFB
- YM3200C4T20FG
- YM3050C4T20FG
- YM3500C4T4MFG
Key Features
- Direct Heating Design: Place directly on the chip for fast, efficient solder ball application without the need for a separate reballing station frame.
- Precision-Cut Apertures: Laser-cut openings ensure uniform solder ball alignment perfectly matched to BGA pad layout.
- Drive IC Ready: Optimized for BGA package Drive ICs used in computer/laptop motherboards.
- Durable Construction: Made from high-quality stainless steel for repeated use and consistent performance across multiple rework sessions.
- No High-Concern Chemicals: Safe handling with no hazardous chemical content.
- Condition: Brand new.
- Quantity: 1 stencil per order.
Who Is This For?
This stencil is ideal for professional electronics repair technicians, BGA rework specialists, and hobbyists who service computer motherboards and need reliable, chip-specific tooling for reballing YM-series Drive IC chips.
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Frequently Asked Questions
Q: What BGA chips is this direct heating stencil compatible with?
A: This stencil is designed specifically for YM-series Drive ICs in BGA packages, including YM3700C4TMFG, YM370BC4T4MFG, YM250BC4T4MFB, YM270BC4T4MFB, YM3200C4T20FG, YM3050C4T20FG, and YM3500C4T4MFG. Always verify the chip marking on your motherboard before use.
Q: What is a direct heating BGA stencil and how does it differ from a reballing station stencil?
A: A direct heating BGA stencil is placed directly on the chip and heated with a hot air rework station to melt and set solder balls in one step. Unlike frame-based stencils, it does not require a separate holder jig, making it faster and more portable for field repairs and bench work.
Q: Is this stencil reusable?
A: Yes. The stencil is crafted from durable stainless steel, allowing it to be cleaned and reused across multiple rework sessions, making it a cost-effective addition to any BGA rework toolkit.
Q: Where is this product made?
A: This BGA direct heating stencil is made in Mainland China.