BGA Direct Heating Stencil 90×90mm – N13M N14M N14P GPU Reballing

BGA Direct Heating Stencil 90×90mm – N13M N14M N14P GPU Reballing

Direct heating / China Mainland
Sale price  $9.43 USD Regular price  $11.06 USD
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BGA Direct Heating Stencil 90×90mm – N13M N14M N14P GPU Reballing

BGA Direct Heating Stencil 90×90mm – N13M N14M N14P GPU Reballing

Sale price  $9.43 USD Regular price  $11.06 USD
Color
Ships FromChina Mainland

Direct Heating BGA Reballing Stencil – 90×90mm for NVIDIA Laptop GPU Chips

Achieve clean, precise solder ball placement with this professional-grade direct heating BGA stencil. Designed specifically for NVIDIA mobile GPU reballing work, this 90×90mm stencil is compatible with a wide range of chip models including N13M-GS-S-A2, N13M-GE-S-A2, N13M-GV-S-A2, N13M-NS-S-A2, N13P-GV2-S-A2, N14M-GS-S-A1, and N14P-GV2-S-A1. Whether you're a professional board-level technician or an experienced hobbyist, this stencil delivers repeatable, accurate results every time.

Key Features

  • Direct Heating Compatible: Designed for use with direct heating reballing stations — no carrier frame required.
  • 90×90mm Format: Standard SMD format fits most reballing jigs and fixtures used in laptop GPU repair.
  • Wide Chip Compatibility: Covers multiple NVIDIA N13M and N14M/N14P series mobile GPU variants in a single stencil.
  • Precision Laser-Cut Apertures: Fine apertures ensure accurate solder ball alignment and uniform placement across every pad.
  • New Condition: Supplied brand new, ready for immediate professional use.
  • Quantity: 1 stencil per order.

Specifications

  • Application: Computer / Laptop GPU reballing
  • Type: Drive IC / BGA Direct Heating Stencil
  • Package: SMD
  • Size: 90 × 90 mm
  • Condition: New
  • Customized: Yes
  • Made in Mainland China

Compatible Chip Models

  • N13M-GS-S-A2
  • N13M-GE-S-A2
  • N13M-GV-S-A2
  • N13M-NS-S-A2
  • N13P-GV2-S-A2
  • N14M-GS-S-A1
  • N14P-GV2-S-A1

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Frequently Asked Questions

Q: What is a direct heating BGA stencil and how is it used?

A: A direct heating BGA stencil is a precision-cut metal template placed directly over a BGA chip to position solder balls accurately during the reballing process. Unlike indirect (frame) stencils, direct heating stencils allow the hot air or infrared heat source to be applied directly through the stencil, melting the solder balls into place without removing the stencil first. This method is widely preferred by professional technicians for speed and consistency.

Q: Which laptop GPU chips is this stencil compatible with?

A: This 90×90mm direct heating stencil is compatible with the following NVIDIA mobile GPU chip models: N13M-GS-S-A2, N13M-GE-S-A2, N13M-GV-S-A2, N13M-NS-S-A2, N13P-GV2-S-A2, N14M-GS-S-A1, and N14P-GV2-S-A1. These chips are commonly found in various mid-range gaming and multimedia laptops.

Q: Do I need a special reballing station to use this stencil?

A: This stencil is designed for use with direct heating reballing stations or standard BGA rework jigs that accommodate 90×90mm stencils. It does not require a separate carrier frame, making it straightforward to use with most professional BGA reballing setups. A hot air rework station or infrared heater is recommended for best results.

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