BGA Direct Heating Stencil 90×90mm – IT8528VG IT8517 IT8988VG
BGA Direct Heating Stencil 90×90mm – IT8528VG IT8517 IT8988VG
BGA Direct Heating Stencil 90×90mm for IT8528VG, IT8517, IT8988VG, IT8995VG-128, IT8390VG & IT8987VG
Precision-engineered for professional board-level rework, this 90×90mm direct heating BGA stencil is designed to deliver accurate, repeatable solder paste application across a range of ITE Embedded Controller chip models. Whether you're a professional repair technician or an experienced hobbyist, this stencil ensures clean, precise ball grid array soldering every time.
Compatible Models
- IT8528VG
- IT8517
- IT8988VG
- IT8995VG-128
- IT8390VG
- IT8987VG
Key Features
- Direct Heating Design: Allows hot air to flow directly through the stencil for efficient and even solder ball reflow.
- 90×90mm Standard Size: Compatible with most BGA rework stations and jig fixtures.
- Precision Laser-Cut Apertures: Ensures consistent solder paste volume and placement accuracy for each pad.
- Durable Stencil Material: Built to withstand repeated use across multiple rework sessions without warping or deforming.
- SMD & BGA Package Support: Suitable for surface-mount and ball grid array component rework on laptop and computer motherboards.
- New Condition: Each stencil is supplied brand new, ready for immediate professional use.
Ideal For
- Laptop and computer motherboard repair
- Embedded controller chip reballing and replacement
- BGA rework station operators
- Electronics repair shops and technicians
Made in Mainland China.
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Frequently Asked Questions
Q: What chip models is this BGA direct heating stencil compatible with?
A: This 90×90mm BGA stencil is compatible with ITE Embedded Controller models including IT8528VG, IT8517, IT8988VG, IT8995VG-128, IT8390VG, and IT8987VG — commonly found in laptop and computer motherboards.
Q: What is a direct heating BGA stencil and how is it used?
A: A direct heating BGA stencil is a precision laser-cut template placed over a BGA chip pad array. Hot air passes directly through the stencil apertures during rework, allowing accurate solder paste or flux application and even reflow of solder balls. It is used with a BGA rework station for chip reballing or replacement.
Q: Is this stencil reusable?
A: Yes. The stencil is made from durable material designed to withstand multiple rework sessions. Proper cleaning after each use will extend its lifespan and maintain aperture precision.
Q: What size is this stencil and will it fit my rework station?
A: The stencil measures 90×90mm, which is a standard size compatible with the majority of BGA rework stations and jig holders available on the market.