BGA Direct Heating Stencil 90×90mm | 11th Gen Intel CPU
BGA Direct Heating Stencil 90×90mm | 11th Gen Intel CPU
BGA Direct Heating Reballing Stencil – 90×90mm for 11th Gen Intel CPUs
This precision-engineered 90×90mm BGA direct heating reballing stencil is designed for professional laptop motherboard repair technicians. Compatible with a wide range of 11th Generation Intel Core CPUs, this stencil ensures accurate solder ball placement for reliable, clean reballing results every time.
Compatible CPU Models
- Intel Core i9-11900H – SRKT7
- Intel Core i7-11850H – SRKT4
- Intel Core i7-11800H – SRKT3
- Intel Core i5-11500H – SRKT2
- Intel Core i5-11400H – SRKT1
- Intel Core i5-11260H – SRKT0
Key Features
- Direct Heating Design: Allows hot air or infrared rework stations to apply heat directly through the stencil for faster, more uniform ball placement.
- 90×90mm Format: Precisely sized to match the BGA footprint of Intel 11th Gen H-series processors.
- High Precision Laser-Cut Holes: Ensures consistent solder ball alignment across every pad for professional-grade results.
- Durable Stainless Steel Construction: Withstands repeated use and high rework temperatures without warping or deforming.
- BGA Package Compatible: Fully compatible with standard BGA reballing processes and solder balls.
- Condition: Brand new.
Specifications
- Stencil Size: 90 × 90 mm
- Type: Direct Heating BGA Reballing Stencil
- Package Type: BGA
- Application: Laptop / Computer CPU reballing
- Quantity: 1 stencil per order
- Condition: New
- Made in Mainland China
Who Is This For?
Ideal for professional electronics repair technicians, laptop motherboard rework specialists, and hobbyist repairers who work with Intel 11th Gen H-series CPUs. Whether you are performing a single repair or handling high-volume board-level rework, this stencil delivers the accuracy and repeatability you need.
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Frequently Asked Questions
Q: What CPUs is this BGA direct heating stencil compatible with?
A: This 90×90mm stencil is compatible with the following 11th Generation Intel H-series processors: Core i9-11900H (SRKT7), Core i7-11850H (SRKT4), Core i7-11800H (SRKT3), Core i5-11500H (SRKT2), Core i5-11400H (SRKT1), and Core i5-11260H (SRKT0).
Q: What is "direct heating" in a BGA reballing stencil?
A: A direct heating stencil is designed so that hot air or infrared heat from your rework station passes directly through the stencil to melt and set the solder balls onto the BGA pads. This method provides more even heat distribution compared to indirect heating stencils, resulting in more consistent and reliable reballing outcomes.
Q: How many stencils are included per order?
A: Each order includes one (1) BGA direct heating reballing stencil measuring 90×90mm.
Q: Is this stencil reusable?
A: Yes. The stencil is constructed from durable stainless steel, making it resistant to high rework temperatures and suitable for repeated use across multiple reballing sessions.