{"product_id":"amaoe-u-qsu5-bga-reballing-stencil-snapdragon-888-865-8gen2","title":"AMAOE U-QSU5 BGA Reballing Stencil – Snapdragon 888 865 8Gen2","description":"\u003ch2\u003eAMAOE U-QSU5 BGA GPU Reballing Stencil for Snapdragon Chipsets\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eAMAOE U-QSU5 BGA Reballing Stencil\u003c\/strong\u003e is a professional-grade tool designed for technicians and electronics repair specialists working with Qualcomm Snapdragon processors. Engineered for precise ball grid array (BGA) reballing, this stencil ensures accurate solder ball placement for a wide range of flagship and mid-range Snapdragon chipsets — making GPU and SoC rework clean, repeatable, and reliable.\u003c\/p\u003e\n\n\u003cp\u003eMade in Mainland China.\u003c\/p\u003e\n\n\u003ch3\u003eCompatible Chipsets\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003eSnapdragon SM8550 \/ 8 Gen 2\u003c\/li\u003e\n  \u003cli\u003eSnapdragon SM8475 \/ 8 Gen 1+\u003c\/li\u003e\n  \u003cli\u003eSnapdragon SM8450 \/ 8 Gen 1\u003c\/li\u003e\n  \u003cli\u003eSnapdragon SM8425\u003c\/li\u003e\n  \u003cli\u003eSnapdragon SM8350 \/ 888\u003c\/li\u003e\n  \u003cli\u003eSnapdragon SM8250 \/ 865\u003c\/li\u003e\n  \u003cli\u003eSnapdragon SM7475\u003c\/li\u003e\n  \u003cli\u003eModels: 002 \/ 102 variants\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eKey Features\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\n\u003cstrong\u003ePrecision-machined stencil\u003c\/strong\u003e — laser-cut apertures ensure consistent, accurate solder ball placement every time\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eBGA package compatible\u003c\/strong\u003e — purpose-built for ball grid array chip rework and reballing workflows\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eWide chipset coverage\u003c\/strong\u003e — a single stencil supports multiple Snapdragon SoC generations, reducing tooling costs\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eNew condition\u003c\/strong\u003e — supplied brand new, ready for immediate professional use\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eCustom design\u003c\/strong\u003e — tailored to the specific ball layout of targeted Snapdragon GPU\/SoC packages\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eDurable construction\u003c\/strong\u003e — built to withstand repeated rework sessions and high-temperature soldering processes\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eWhat's in the Box\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e1× AMAOE U-QSU5 BGA Reballing Stencil\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eWho Is This For?\u003c\/h3\u003e\n\u003cp\u003eThis stencil is ideal for professional mobile phone board-level repair technicians, microsoldering specialists, and electronics workshops that regularly service Qualcomm Snapdragon-based devices. Whether you're reballing a damaged GPU or refurbishing a motherboard, this stencil delivers the accuracy and repeatability your work demands.\u003c\/p\u003e\n\n\u003ch3\u003eRelated Products You May Find Useful\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\u003ca href=\"\/products\/electromagnetic-induction-tester-coil-motherboard-fault-detector\"\u003eElectromagnetic Induction Tester – Coil \u0026amp; Circuit Fault Detector\u003c\/a\u003e\u003c\/li\u003e\n  \u003cli\u003e\u003ca href=\"\/products\/air-compressor-pressure-gauge-0-10-0-12-0-25-bar-hydraulic-diy\"\u003eAir Compressor Pressure Gauge 0-10\/0-12\/0-25 Bar | DIY Tool\u003c\/a\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003cp\u003eLearn more: \u003ca href=\"https:\/\/www.osha.gov\/hand-power-tools\" target=\"_blank\" rel=\"noopener\"\u003eOSHA guidance on hand and power tools\u003c\/a\u003e\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003ch4\u003eQ: Which Snapdragon chipsets is the AMAOE U-QSU5 BGA reballing stencil compatible with?\u003c\/h4\u003e\n\u003cp\u003eA: The AMAOE U-QSU5 stencil is compatible with a wide range of Qualcomm Snapdragon processors including the SM8550 (8 Gen 2), SM8475 (8 Gen 1+), SM8450 (8 Gen 1), SM8425, SM8350 (888), SM8250 (865), and SM7475, covering both 002 and 102 board variants.\u003c\/p\u003e\n\u003ch4\u003eQ: What is BGA reballing and why do I need a dedicated stencil?\u003c\/h4\u003e\n\u003cp\u003eA: BGA (Ball Grid Array) reballing is the process of removing old solder balls from a chip package and applying new ones before resoldering the chip to a PCB. A precision-machined stencil like the AMAOE U-QSU5 is essential because it holds each solder ball in exactly the correct position, matching the chip's ball layout, ensuring a reliable electrical connection after rework.\u003c\/p\u003e\n\u003ch4\u003eQ: Is this stencil reusable across multiple reballing jobs?\u003c\/h4\u003e\n\u003cp\u003eA: Yes. The AMAOE U-QSU5 is constructed from durable material capable of withstanding repeated high-temperature soldering sessions, making it a cost-effective tool for professional repair workshops handling multiple Snapdragon chipset reworks.\u003c\/p\u003e\n\u003ch4\u003eQ: Where is this reballing stencil made?\u003c\/h4\u003e\n\u003cp\u003eA: The AMAOE U-QSU5 BGA reballing stencil is made in Mainland China.\u003c\/p\u003e\n\u003cscript type=\"application\/ld+json\"\u003e{\"@context\": \"https:\/\/schema.org\", \"@type\": \"FAQPage\", \"mainEntity\": [{\"@type\": \"Question\", \"name\": \"Which Snapdragon chipsets is the AMAOE U-QSU5 BGA reballing stencil compatible with?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"The AMAOE U-QSU5 stencil is compatible with a wide range of Qualcomm Snapdragon processors including the SM8550 (8 Gen 2), SM8475 (8 Gen 1+), SM8450 (8 Gen 1), SM8425, SM8350 (888), SM8250 (865), and SM7475, covering both 002 and 102 board variants.\"}}, {\"@type\": \"Question\", \"name\": \"What is BGA reballing and why do I need a dedicated stencil?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"BGA (Ball Grid Array) reballing is the process of removing old solder balls from a chip package and applying new ones before resoldering the chip to a PCB. A precision-machined stencil like the AMAOE U-QSU5 is essential because it holds each solder ball in exactly the correct position, matching the chip's ball layout, ensuring a reliable electrical connection after rework.\"}}, {\"@type\": \"Question\", \"name\": \"Is this stencil reusable across multiple reballing jobs?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"Yes. The AMAOE U-QSU5 is constructed from durable material capable of withstanding repeated high-temperature soldering sessions, making it a cost-effective tool for professional repair workshops handling multiple Snapdragon chipset reworks.\"}}, {\"@type\": \"Question\", \"name\": \"Where is this reballing stencil made?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"The AMAOE U-QSU5 BGA reballing stencil is made in Mainland China.\"}}]}\u003c\/script\u003e\n\u003cscript type=\"application\/ld+json\"\u003e{\"@context\": \"https:\/\/schema.org\", \"@type\": \"BreadcrumbList\", \"itemListElement\": [{\"@type\": \"ListItem\", \"position\": 1, \"name\": \"Home\", \"item\": \"https:\/\/n8ande-60.myshopify.com\/\"}, {\"@type\": \"ListItem\", \"position\": 2, \"name\": \"Home page\", \"item\": \"https:\/\/n8ande-60.myshopify.com\/collections\/frontpage\"}, {\"@type\": \"ListItem\", \"position\": 3, \"name\": \"AMAOE U-QSU5 BGA Reballing Stencil – Snapdragon 888 865 8Gen2\", \"item\": \"https:\/\/n8ande-60.myshopify.com\/products\/amaoe-u-qsu5-bga-reballing-stencil-snapdragon-888-865-8gen2\"}]}\u003c\/script\u003e","brand":"Axl","offers":[{"title":"Khaki \/ China Mainland","offer_id":43692671074365,"sku":"14:1202;200007763:201336100","price":14.48,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0671\/3439\/0333\/files\/Secd58a52dfa8452b81e7acadf0b6c93di.webp?v=1790178267","url":"https:\/\/qtiply.com\/products\/amaoe-u-qsu5-bga-reballing-stencil-snapdragon-888-865-8gen2","provider":"QTP","version":"1.0","type":"link"}