AMAOE BGA Reballing Stencil GTX1660 RTX2080 2070 2060 TU116
AMAOE BGA Reballing Stencil GTX1660 RTX2080 2070 2060 TU116
AMAOE Direct Heating BGA Reballing Stencil for NVIDIA GTX/RTX GPU Chips
Precision-engineered for professional GPU rework, this AMAOE direct heating BGA reballing stencil is compatible with a wide range of NVIDIA graphics chips including GTX 1660, RTX 2080, RTX 2070, RTX 2060, and chip variants TU116-300-A1, TU116-250-KA-A1, N18P-G61, TU116, and TU116B. Designed for accurate solder ball placement during BGA rework and chip reballing procedures on graphics cards and computer motherboards.
Made in Mainland China.
Key Features
- Direct Heating Design: Allows direct application of hot air without a separate base plate, speeding up your rework workflow
- Wide GPU Compatibility: Supports GTX1660, RTX2080, RTX2070, RTX2060, TU116-300-A1, TU116-250-KA-A1, N18P-G61, TU116, TU116B chip variants
- Precision Laser-Cut Apertures: Ensures perfectly sized and positioned solder ball deposits for reliable BGA connections
- Durable Construction: Manufactured from high-quality stainless steel for long-lasting, repeatable use
- Professional Grade: Ideal for electronics repair technicians, GPU rework shops, and experienced DIY repairers
- Condition: Brand new
- Package: BGA stencil × 1
Compatibility
- NVIDIA GTX 1660 / GTX 1660 Ti / GTX 1660 Super
- NVIDIA RTX 2080 / RTX 2070 / RTX 2060
- Chip IDs: TU116-300-A1, TU116-250-KA-A1, N18P-G61, TU116, TU116B
- Application: Computer graphics card BGA rework
Who Is This For?
This stencil is perfect for electronics repair professionals, laptop and desktop GPU rework technicians, and advanced hobbyists who perform BGA reballing and chip-level repairs on graphics cards. It streamlines the soldering process and helps ensure clean, precise results every time.
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Frequently Asked Questions
Q: Which GPU chip models is this BGA reballing stencil compatible with?
A: This AMAOE direct heating stencil is compatible with NVIDIA GTX 1660, RTX 2080, RTX 2070, and RTX 2060 series chips, including specific chip IDs: TU116-300-A1, TU116-250-KA-A1, N18P-G61, TU116, and TU116B. Always verify your chip ID before purchasing.
Q: What is a direct heating BGA stencil and how is it used?
A: A direct heating BGA stencil is placed directly over the chip pads on the PCB. Solder paste or solder balls are applied through the stencil's laser-cut apertures, and hot air is then applied directly through the stencil to reflow the solder. This eliminates the need for a separate holder base plate, making the rework process faster and more efficient.
Q: Is this stencil reusable?
A: Yes. The stencil is constructed from durable stainless steel, making it suitable for multiple uses. Proper cleaning and storage after each use will extend its lifespan significantly.
Q: How many stencils are included in the package?
A: Each order includes one (1) BGA reballing stencil. Additional stencils can be purchased as separate units.