Amaoe BGA Reballing Stencil GDDR6 FBGA180 DDR6 GPU Memory
Amaoe BGA Reballing Stencil GDDR6 FBGA180 DDR6 GPU Memory
Amaoe BGA Reballing Stencil – GDDR6 / DDR6 FBGA180
Achieve precise, professional-grade BGA reballing results with this dedicated Amaoe stencil designed specifically for GDDR6 / DDR6 FBGA180 memory chips. Compatible with a wide range of popular GPU memory ICs including D9WCW, D9WCR, D8BGW, D8BGX, D8BZC, K4ZAF325BM-HC16, K4Z80325BC-HC12, and K4Z80325BC-HC14, this stencil is an essential tool for graphics card repair technicians, motherboard rework specialists, and BGA rework professionals.
Key Features
- Precision-Laser-Cut Apertures: Each hole is machined to exact tolerances to ensure consistent, uniform solder ball placement across all FBGA180 pads.
- Wide Chip Compatibility: Supports GDDR6/DDR6 memory packages used on modern high-performance graphics cards and computing modules — including D9WCW, D9WCR, D8BGW, D8BGX, D8BZC, K4ZAF325BM-HC16, K4Z80325BC-HC12, and K4Z80325BC-HC14.
- Durable Stainless Steel Construction: Built to withstand repeated use in high-temperature reflow environments without warping or deforming.
- SMD Package Format: Ready to use with standard reballing jigs and fixtures for efficient, professional workflow.
- New Condition: Supplied brand new, clean, and ready for immediate use.
Who Is This For?
This stencil is ideal for:
- Graphics card and GPU repair technicians
- Motherboard and laptop BGA rework specialists
- Electronics repair shops handling GDDR6 memory reballing
- Hobbyists and professionals performing precise BGA solder ball replacement
Specifications
- Application: Computer / GPU Memory Reballing
- Compatible Chips: D9WCW, D9WCR, D8BGW, D8BGX, D8BZC, K4ZAF325BM-HC16, K4Z80325BC-HC12, K4Z80325BC-HC14
- Memory Type: GDDR6 / DDR6 FBGA180
- Package Type: SMD
- Condition: New
- Country of Origin: Made in Mainland China
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Frequently Asked Questions
Q: Which GDDR6 memory chips is this BGA reballing stencil compatible with?
A: This Amaoe FBGA180 stencil is compatible with GDDR6/DDR6 memory ICs including D9WCW, D9WCR, D8BGW, D8BGX, D8BZC, K4ZAF325BM-HC16, K4Z80325BC-HC12, and K4Z80325BC-HC14. It is designed for professional reballing of modern GPU and high-performance computing memory chips.
Q: Can this stencil be reused multiple times?
A: Yes. The stencil is made from durable stainless steel with precision-laser-cut apertures, making it suitable for repeated use across multiple reballing sessions without loss of accuracy or dimensional integrity.
Q: What equipment do I need to use this BGA reballing stencil?
A: You will need a standard BGA reballing jig or fixture to hold the stencil in alignment, solder balls of the correct diameter for FBGA180 pads, flux paste, and a hot air rework station or reflow oven to complete the reballing process.