Amaoe BGA Reballing Stencil for Xiaomi CPU Phone Repair
Amaoe BGA Reballing Stencil for Xiaomi CPU Phone Repair
Amaoe BGA Reballing Stencil – Xiaomi CPU Series Phone Repair Tool
Get precision BGA reballing results with the Amaoe BGA Reballing Stencil, engineered specifically for Xiaomi CPU chip repair across a wide range of popular series including Mi 2, 3, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, CC9, K20, and K30 Pro. Whether you're a professional phone technician or an experienced DIY repair enthusiast, this stencil delivers the accuracy you need for clean, reliable solder ball placement every time.
Made in Mainland China.
Key Features
- Wide Compatibility: Designed for Xiaomi Mi series CPUs including Mi 2, 3, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, CC9, K20, and K30 Pro models.
- High Precision Laser-Cut: Fine-pitch apertures ensure accurate solder ball alignment on CPU and IC chips for professional-grade reballing results.
- Durable Construction: Made from quality stainless steel for long-lasting performance and repeated use without warping or deformation.
- Brand: Amaoe – a trusted name in professional mobile phone repair tooling.
- Condition: Brand new.
- Quantity: 1 stencil per package.
- No high-concern chemicals – safe for regular workshop use.
Who Is This For?
This reballing stencil is ideal for:
- Mobile phone repair technicians working on Xiaomi devices
- Electronics repair shops handling BGA chip rework
- Hobbyist repairers tackling CPU-level soldering projects
Related Products You May Like
- Electromagnetic Induction Tester – Coil & Circuit Fault Detector
- Air Compressor Pressure Gauge 0-10/0-12/0-25 Bar | DIY Tool
- 360° Bicycle Chain Cleaner Tool | Bike Gear Cleaning Kit
Learn more: OSHA guidance on hand and power tools
Frequently Asked Questions
Q: Which Xiaomi phone models is this BGA reballing stencil compatible with?
A: This Amaoe BGA reballing stencil is compatible with Xiaomi Mi series models including Mi 2, 3, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, CC9, K20 Pro, and K30 Pro series CPUs. Always verify your specific chip footprint before use.
Q: What is a BGA reballing stencil used for?
A: A BGA (Ball Grid Array) reballing stencil is a precision tool used in electronics repair to accurately place solder balls onto CPU or IC chips after the original solder balls have been removed. It ensures proper alignment and consistent solder ball sizing for reliable chip reconnection to the circuit board.
Q: Is this stencil reusable?
A: Yes, this stencil is crafted from durable stainless steel, making it reusable across multiple reballing sessions without loss of precision or structural integrity.
Q: How many stencils are included in the package?
A: Each order includes 1 BGA reballing stencil. Please check the product variant selector for the specific model stencil you require.