AMAOE BGA Reballing Stencil DDR3–DDR6 Direct Heating 0.25mm
AMAOE BGA Reballing Stencil DDR3–DDR6 Direct Heating 0.25mm
AMAOE BGA Direct Heating Reballing Stencil for DDR3 / DDR4 / DDR5 / DDR6
Achieve precise, professional-grade BGA reballing every time with the AMAOE BGA Direct Heating Reballing Template. Engineered at a ultra-thin 0.25 mm thickness, this stencil is purpose-built for RAM chip rework on DDR3, DDR4, DDR5, and DDR6 memory packages. Whether you're a seasoned board-level technician or a dedicated repair enthusiast, this template delivers consistent solder ball placement with minimal waste.
Made in Mainland China.
Key Features
- Universal DDR Compatibility: Supports DDR3, DDR4, DDR5, and DDR6 BGA memory chips in a single stencil — no need to swap templates between jobs.
- 0.25 mm Precision Thickness: The optimised stencil thickness ensures accurate solder ball volume and uniform deposition across every pad.
- Direct Heating Design: Compatible with hot-air and infrared rework stations for a streamlined, direct-heat reballing workflow.
- High-Quality Laser-Cut Steel: Precision laser-etched apertures deliver clean, burr-free openings that resist warping under rework temperatures.
- Reusable & Easy to Clean: The durable stainless construction allows repeated use — simply clean with flux remover between sessions.
- Condition: Brand new, ready to use right out of the package.
Specifications
| Compatible Memory Types | DDR3, DDR4, DDR5, DDR6 |
| Stencil Thickness | 0.25 mm |
| Heating Method | Direct Heating (BGA) |
| Application | Computer / Laptop / Server Board Repair |
| Package Contents | 1 × BGA Reballing Stencil |
| Condition | New |
| Origin | Mainland China |
Who Is This For?
This stencil is an essential addition to the toolkit of board-level repair technicians, micro-soldering professionals, electronics hobbyists, and anyone performing BGA rework on desktop, laptop, or server RAM modules. It pairs perfectly with standard BGA reballing kits and flux.
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Frequently Asked Questions
Q: Which DDR memory types is this BGA reballing stencil compatible with?
A: This AMAOE stencil is compatible with DDR3, DDR4, DDR5, and DDR6 BGA memory packages, making it a versatile single-stencil solution for a wide range of computer RAM rework and repair tasks.
Q: What thickness is this BGA stencil and why does it matter?
A: The stencil is 0.25 mm thick. This precise thickness controls the volume of solder paste or solder balls deposited onto each BGA pad, ensuring consistent joints and reducing the risk of bridging or insufficient solder during the reballing process.
Q: Is this stencil compatible with hot-air rework stations?
A: Yes. This is a direct heating BGA stencil, designed to work with hot-air rework stations and infrared (IR) rework systems commonly used in professional board-level repair environments.
Q: Can this stencil be reused multiple times?
A: Absolutely. The stencil is made from durable laser-cut steel that withstands repeated rework sessions. Simply clean it thoroughly with isopropyl alcohol or flux remover after each use to maintain aperture clarity and performance.