90x90mm Direct Heating BGA Reballing Stencil – Multi-Chip
90x90mm Direct Heating BGA Reballing Stencil – Multi-Chip
90x90mm Direct Heating BGA Reballing Stencil
Achieve precise, professional solder ball placement with this 90x90mm direct heating BGA reballing stencil. Compatible with a wide range of popular CPU and GPU chip models — including SRKM2, SRKM3, SRKM5, SRKM6, SRKMA, SRKMB, SRKMC, SRH8W, QWC2, QX04, SRJ7X, and FH82HM570 — this stencil is an essential tool for electronics repair technicians and hardware enthusiasts tackling motherboard and chip-level rework.
Key Features
- Direct Heating Design: Allows solder balls to be applied directly with hot air or infrared heat, streamlining the reballing process for faster, more consistent results.
- 90x90mm Format: Sized to fit a broad range of modern laptop and desktop processor chips, reducing the need for multiple stencils.
- Wide Chip Compatibility: Supports SRKM2, SRKM3, SRKM5, SRKM6, SRKMA, SRKMB, SRKMC, SRH8W, QWC2, QX04, SRJ7X, FH82HM570, and more.
- High Precision Laser-Cut Apertures: Ensures accurate solder ball alignment for reliable solder joints every time.
- Durable Construction: Made from quality stainless steel for long-lasting performance across multiple rework sessions.
- New Condition: Each stencil ships brand new, ready for immediate professional use.
- SMD Package Compatible: Designed for surface-mount device (SMD) rework applications.
Compatible Chip Models
SRKM2 | SRKM3 | SRKM5 | SRKM6 | SRKMA | SRKMB | SRKMC | SRH8W | QWC2 | QX04 | SRJ7X | FH82HM570
Package Contents
- 1 x 90x90mm Direct Heating BGA Reballing Stencil
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Made in Mainland China.
Learn more: OSHA guidance on hand and power tools
Frequently Asked Questions
Q: What chip models is this 90x90mm BGA reballing stencil compatible with?
A: This stencil is compatible with a wide range of chips including SRKM2, SRKM3, SRKM5, SRKM6, SRKMA, SRKMB, SRKMC, SRH8W, QWC2, QX04, SRJ7X, and FH82HM570, making it suitable for many common laptop and desktop CPU/GPU rework jobs.
Q: What does "direct heating" mean for a BGA reballing stencil?
A: A direct heating stencil is placed directly on the chip and heated with a hot air gun or infrared station. This allows solder balls to be melted and set in place without needing a separate flux plate, resulting in a faster and more straightforward reballing process.
Q: Is this stencil reusable?
A: Yes. The stainless steel construction makes this BGA reballing stencil durable and reusable across multiple rework sessions, provided it is cleaned properly after each use.
Q: What size is this reballing stencil?
A: The stencil measures 90x90mm, which is a versatile size that covers a broad range of modern CPU and GPU chips used in laptops and desktop motherboards.