90x90 BGA Direct Heating Stencil – 10th Gen CPU SRGKG SRGKK
90x90 BGA Direct Heating Stencil – 10th Gen CPU SRGKG SRGKK
90×90mm Direct Heating BGA Stencil for 10th Generation CPUs
Precision-engineered for professional motherboard repair technicians, this 90×90mm direct heating BGA stencil is compatible with 10th Generation Intel CPU models including SRGKG, SRGKK, SRG0N, SRGKL, and SRG0S. Designed for direct reballing and soldering workflows, this stencil ensures accurate solder ball placement every time — minimising rework and maximising throughput on the bench.
Made in Mainland China.
Key Features
- Direct Heating Design: Place directly on the CPU — no transfer station or separate base required, streamlining your reballing process.
- Precision Laser-Cut Apertures: Tight tolerances ensure consistent, uniform solder ball alignment across all pads.
- 90×90mm Format: Matches the standard BGA package footprint for 10th Gen Intel CPUs.
- Compatible Models: SRGKG, SRGKK, SRG0N, SRGKL, SRG0S — ideal for laptop and desktop motherboard repair.
- Durable Stainless Steel Construction: Resists warping under heat for repeated, reliable use session after session.
- New Condition: Each unit ships brand new, ready for immediate use.
- Package Includes: 1 × BGA Reballing Stencil
Who Is This For?
This stencil is a must-have for electronics repair professionals, BGA rework specialists, and hobbyist technicians who regularly service Intel 10th Generation CPU platforms. Whether you're refurbishing laptops or repairing desktop boards, this tool delivers the accuracy you need.
Related Products You May Like
- Electromagnetic Induction Tester – Coil & Circuit Fault Detector
- Air Compressor Pressure Gauge 0-10/0-12/0-25 Bar | DIY Tool
Learn more: OSHA on eye and face protection
Frequently Asked Questions
Q: What CPU models is this BGA stencil compatible with?
A: This 90×90mm direct heating BGA stencil is compatible with 10th Generation Intel CPU models SRGKG, SRGKK, SRG0N, SRGKL, and SRG0S, making it ideal for a wide range of laptop and desktop motherboard repair jobs.
Q: What does "direct heating" mean for a BGA stencil?
A: A direct heating stencil is placed directly onto the CPU chip during the reballing process. This eliminates the need for a separate transfer base or intermediate step, saving time and reducing the risk of solder ball misalignment during rework.
Q: How many stencils are included in the package?
A: The package includes 1 × BGA reballing stencil. It is supplied new and ready for immediate use in professional or hobbyist repair environments.
Q: Is this stencil reusable?
A: Yes. The stainless steel construction is designed to withstand repeated heating cycles without warping, making this stencil a durable, long-term addition to your BGA rework toolkit.