90×90mm Direct Heat BGA Stencil – SAK-TC1797 & SAK-TC1796
90×90mm Direct Heat BGA Stencil – SAK-TC1797 & SAK-TC1796
Direct Heat BGA Reballing Stencil – SAK-TC1797 & SAK-TC1796 (90×90mm)
Achieve precise, professional-grade BGA reballing results with this 90×90mm Direct Heat Stencil designed specifically for SAK-TC1797, SAK-TC1797-512F180E AC, and SAK-TC1796-256F150EBE chips. Engineered for accuracy, this stencil ensures perfect solder ball placement every time — making it an essential tool for electronics repair technicians, rework specialists, and hobbyists alike.
Key Features
- Chip Compatibility: Purpose-built for SAK-TC1797, SAK-TC1797-512F180E AC, and SAK-TC1796-256F150EBE ICs
- Size: 90×90mm — optimized for direct heat reballing workflows
- Direct Heat Design: Allows hot air or infrared heat to be applied directly through the stencil for fast, clean reballing
- High-Precision Apertures: Laser-cut holes ensure uniform, correctly sized solder balls for reliable connections
- Durable Construction: Made from quality stainless steel for long-lasting, repeated use
- Condition: Brand new
- Package Type: SMD-compatible
- No Hazardous Chemicals: Free from high-concern chemical substances
Who Is This For?
This stencil is ideal for PCB repair technicians, electronics rework professionals, and advanced DIY enthusiasts who need reliable, chip-specific BGA reballing tools. Whether you're working on automotive ECU boards, industrial control units, or embedded systems using the SAK-TC1796 or SAK-TC1797 processors, this stencil delivers consistent, repeatable results.
What's in the Box?
- 1× Direct Heat BGA Reballing Stencil (90×90mm)
Made in Mainland China.
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Frequently Asked Questions
Q: What chips is this direct heat BGA stencil compatible with?
A: This 90×90mm direct heat BGA reballing stencil is specifically designed for the SAK-TC1797, SAK-TC1797-512F180E AC, and SAK-TC1796-256F150EBE integrated circuits, ensuring precise aperture alignment for these chip variants.
Q: What does "direct heat" mean for a BGA stencil?
A: A direct heat BGA stencil is designed to withstand and conduct heat applied directly through the stencil using a hot air gun or infrared rework station. This allows solder balls to be placed and melted onto the chip pads without needing to remove the stencil first, making the reballing process faster and more accurate.
Q: Is this stencil reusable?
A: Yes. This stencil is constructed from durable stainless steel with laser-cut apertures, making it suitable for multiple reballing sessions when properly cleaned and stored after each use.