11th Gen CPU BGA Stencil SRK01–SRK08 | 90x90mm Steel Mesh
11th Gen CPU BGA Stencil SRK01–SRK08 | 90x90mm Steel Mesh
11th Generation CPU BGA Stencil – 90x90mm Direct Heating Steel Mesh
Precision-engineered for professional CPU reballing, this 90x90mm BGA stencil is compatible with 11th Generation CPU chip models including SRK01, SRK02, SRK04, SRK05, SRK07, and SRK08. Whether you're a seasoned board-level repair technician or an electronics hobbyist, this direct-heating steel mesh makes solder ball planting fast, accurate, and repeatable.
Made in Mainland China.
Key Features
- Wide Compatibility: Designed specifically for 11th Gen CPU BGA IC chip packages — supports SRK01, SRK02, SRK04, SRK05, SRK07, and SRK08 variants.
- Direct Heating Design: Place the stencil directly on the chip and apply heat — no additional fixtures required for most setups.
- High-Quality Steel Construction: Laser-cut stainless steel mesh delivers consistent, precise solder ball placement with minimal waste.
- 90x90mm Standard Size: Industry-standard dimensions fit most BGA reballing fixtures and workstations.
- Drive IC / BGA Package: Ideal for computer motherboard repair and chip-level rework involving BGA-packaged ICs.
- New Condition: Ships as a brand-new unit — no high-concern chemicals, ready to use straight from the package.
What's in the Box
- 1x 90x90mm BGA Direct Heating Steel Stencil (11th Gen CPU – SRK Series)
Who Is This For?
This stencil is ideal for electronics repair shops, IT technicians, and DIY computer repair enthusiasts who perform CPU reballing or BGA rework on laptops and desktop motherboards featuring 11th Generation Intel-compatible processors.
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Frequently Asked Questions
Q: Which CPU chip models is this BGA stencil compatible with?
A: This 90x90mm direct heating steel stencil is specifically designed for 11th Generation CPU BGA IC chips, including SRK01, SRK02, SRK04, SRK05, SRK07, and SRK08 package types.
Q: Do I need a special fixture to use this direct heating BGA stencil?
A: This stencil uses a direct heating design, meaning it can be placed directly on the chip surface for solder ball planting without requiring a separate fixture in most standard reballing setups. A BGA reballing station or soldering station with temperature control is recommended for best results.
Q: What material is the stencil made from?
A: The stencil is laser-cut from stainless steel, providing durable, precise holes for consistent and accurate solder ball placement during BGA rework.
Q: What size is this BGA stencil?
A: The stencil measures 90x90mm, which is an industry-standard size compatible with most BGA reballing fixtures and workstations used for computer motherboard repair.