0.55mm Direct Heating Steel Mesh Stencil GPU BGA Reballing
0.55mm Direct Heating Steel Mesh Stencil GPU BGA Reballing
0.55mm Direct Heating Steel Mesh Stencil – GPU BGA Reballing Tool
Achieve precise, professional-grade BGA reballing results with this 0.55mm Direct Heating Steel Mesh Stencil. Designed for compatibility with a wide range of GPU chipsets — including Tu117-300-A1, Tu117-400-A1, N18P-G0-A1, N18P-G0-Mp-A1, N18P-G61-A1, N18P-G62-A1, and N18P-G61-Mp-A1 — this stencil is an essential tool for electronics technicians, laptop repair specialists, and computer hardware refurbishers.
Crafted from high-quality stainless steel with a precise 0.55mm aperture, this 90×90mm mesh stencil ensures accurate solder ball placement every time. The direct heating design allows for efficient heat transfer during the reballing process, making your workflow faster and more reliable.
Key Features
- Size: 90 × 90mm stencil for convenient handling and precise alignment
- Thickness: 0.55mm steel mesh for optimal solder ball deposition
- Direct Heating Design: Enables fast, even heat distribution during reballing
- Wide Compatibility: Fits Tu117-300-A1, Tu117-400-A1, N18P-G0-A1, N18P-G0-Mp-A1, N18P-G61-A1, N18P-G62-A1, N18P-G61-Mp-A1 GPU chipsets
- Type: Drive IC / BGA reballing stencil
- Package: SMD-compatible
- Condition: Brand new
- Made in Mainland China
Who Is This For?
This stencil is ideal for:
- Laptop and desktop GPU chip repair technicians
- Electronics refurbishment professionals
- BGA rework and soldering hobbyists
- Computer hardware repair workshops
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Frequently Asked Questions
Q: Which GPU chipsets is this 0.55mm direct heating steel mesh stencil compatible with?
A: This stencil is compatible with the following GPU chipsets: Tu117-300-A1, Tu117-400-A1, N18P-G0-A1, N18P-G0-Mp-A1, N18P-G61-A1, N18P-G62-A1, and N18P-G61-Mp-A1. Always verify your chip model before purchasing to ensure a proper fit.
Q: What does "direct heating" mean for a BGA reballing stencil?
A: A direct heating stencil is placed directly on the chip and heated along with the solder balls during the reballing process, as opposed to an indirect heating method where solder balls are pre-deposited. This approach provides more efficient heat transfer and more consistent solder ball placement.
Q: What thickness is this steel mesh stencil?
A: This stencil has a thickness of 0.55mm, which is optimized for accurate solder ball deposition on the supported GPU chipsets.
Q: What size is the stencil?
A: The stencil measures 90 × 90mm, making it easy to handle and position precisely during the BGA reballing process.